Method for quickly producing uniform core-shell type alloy solder balls

A core-shell, uniform technology, applied in welding media, manufacturing tools, welding equipment, etc., can solve the problems of low yield and uneven particle size, and achieve the effects of high yield, complex preparation process, and reliability.

Inactive Publication Date: 2015-03-18
TIANJIN UNIV
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the gas atomization method used by Wang Cuiping and others has the problems of low yield and uneven particle size [C.P.Wang, X.J.Liu, I.Ohnuma, et al., Science, 297-9(2002) 990]

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for quickly producing uniform core-shell type alloy solder balls
  • Method for quickly producing uniform core-shell type alloy solder balls

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.

[0031] as attached figure 1 As shown, in the device for preparing core-shell solder balls used in the present invention, 1 is a quartz crucible, 2 is a vacuum chamber, 3 is an induction heating system, 4 is a piezoelectric oscillation system, 5 is an electrode plate, and 6 is a liquid Nitrogen spiral cooling collection device, 7 is a vacuum pump, 8 is a baffle, 9 is an image monitoring system, 10 is a protective gas delivery system connected to a crucible, and 11 is a protective gas delivery system connected to a vacuum chamber.

[0032] The equipment used includes:

[0033] 1) A vacuum chamber connected to a vacuum pump through a gas pipeline with a vacuum valve.

[0034] 2) A quartz crucible with an induction heating system located above the vacuum chamber.

[0035] 3) An image monitoring system, including a strobe, a video camera and a micro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for quickly producing uniform core-shell type alloy solder balls. The method includes the following steps: weighing Cu, Sn and Bi alloys in the appropriate proportion prior to putting the alloy into a crucible, and closing the crucible and a vacuum chamber; heating to enable the metal to melt; jetting out the molten metal from holes in the bottom of the crucible, and performing jet breaking to form uniform small droplets under the condition of oscillation of a piezoelectric oscillator; feeding the uniform droplets into a spiral liquid nitrogen cooling device to form the core-shell type solder balls. The core-shell type solder balls produced by the one-step method have the advantages of high uniformity and high finished product ratio. The defects of complicated original preparation technology and particle nonuniformity are overcome. The requirements on electronic packaging of existing integrated circuits can be met, reliability in solder joint connection is improved, and application and popularization prospect is high.

Description

technical field [0001] The invention belongs to the technical field of alloy metal powder preparation, and more specifically relates to a preparation method of a novel core-shell composite alloy solder ball. Background technique [0002] Now in the electronics industry, ball grid array packaging (BGA packaging) has gradually become the mainstream of electronic packaging technology. This technology uses alloy solder balls instead of previous pins to meet the mechanical interconnection and electrical signal transmission requirements between electronic components. The core technology of the electronic packaging method is the preparation of high-quality alloy solder balls. However, this technology has the disadvantage that the coplanarity is difficult to control during the packaging process, and it is easy to form stress in the solder joint and cause it to short circuit or open circuit. [0003] Core-shell solder balls can well solve the problem of poor coplanarity of BGA solde...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08B22F3/115B23K35/26
Inventor 吴萍周伟穆文凯杨中宝李宝凌
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap