Inclined light-emitting LED (light-emitting diode) packaging structure

A technology for LED packaging and packaging brackets, which is applied to semiconductor devices, light sources, identification devices, etc. of light-emitting elements, and can solve the problems of no individual requirements for oblique lighting, high production costs, and complex designs.

Active Publication Date: 2021-05-18
GUANGDONG GMA OPTOELECTRONICS TECH +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the structure of RGB LEDs is mainly divided into top view LEDs that emit light and side view LEDs that emit light. They are widely used in the display and backlight markets. The current technology is mainly in the form of front-emitting direct-lit or side-lit side-entry. On the board,

Method used

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  • Inclined light-emitting LED (light-emitting diode) packaging structure
  • Inclined light-emitting LED (light-emitting diode) packaging structure
  • Inclined light-emitting LED (light-emitting diode) packaging structure

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Embodiment Construction

[0024] In order to enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings.

[0025] like Figure 1~4 As shown, the present invention discloses an oblique light-emitting LED package structure, which includes a fixed bracket 9 and a package bracket 7, the package bracket 7 is movably embedded inside the fixed bracket 9, and the package bracket 7 is provided with a number of package fixing grooves 8 , the package fixing groove 8 is connected with a number of "7"-shaped inclined functional soldering feet 5, the inclined functional soldering legs 5 include a packaging part, a first connecting part, a first fixing part and a first limiting part, and the packaging part One end of the first connecting part is vertically connected, the other end of the first connecting part is connected obliquely with...

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Abstract

The invention discloses an inclined light-emitting LED packaging structure which comprises a fixing support and a packaging support, the packaging support is movably embedded into the fixing support, a plurality of packaging fixing grooves are formed in the packaging support, each packaging fixing groove is connected with a plurality of 7-shaped inclined functional weld legs, each inclined functional weld leg comprises a packaging part, a first connecting part, a first fixing part and a first limiting part, the packaging part is vertically connected with one end of the first connecting part, the other end of the first connecting part is obliquely connected with one end part of the first fixing part, and the other end part of the first fixing part is connected with the first limiting part. The inclined light-emitting LED packaging structure has the advantages of simple structure, attractiveness, compactness and low cost.

Description

technical field [0001] The invention relates to the technical field of LED package structures, in particular to an LED package structure with oblique light emission. Background technique [0002] At present, the structure of RGB LEDs is mainly divided into top view LEDs that emit light and side view LEDs that emit light. They are widely used in the display and backlight markets. The current technology is mainly in the form of front-emitting direct-lit or side-lit side-entry. On the board, the packaging structure does not meet the individual needs of the application for oblique lighting; application-side manufacturers use Top view LED or Side view LED structure for oblique lighting product design, the design is complicated, the production cost is high, and the appearance is not beautiful. Contents of the invention [0003] The object of the present invention is to provide an obliquely emitting LED packaging structure, which has the characteristics of simple structure, compa...

Claims

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Application Information

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IPC IPC(8): F21V19/00G09F9/30F21Y115/10
CPCF21V19/0015G09F9/30F21Y2115/10
Inventor 廖勇军李文庭戢利进
Owner GUANGDONG GMA OPTOELECTRONICS TECH
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