Surface-mounted thin film capacitor and manufacturing method thereof

Abstract

According to the surface-mounted thin film capacitor and the manufacturing method, the thin film capacitor is more miniaturized, and the requirement for integration of miniaturized circuit elements is met. The film capacitor comprises a capacitor core with an elliptical end face, two ends of the capacitor core are respectively connected with an electrode, the electrode is of an integrally formed structure and is approximately Z-shaped, and the inner electrode face of the electrode is fixedly connected with the capacitor core; the capacitor further comprises a U-shaped shell, notch parts are arranged at the ends of the two outer side faces of the shell, insertion teeth are arranged in the notch parts, insertion holes matched with the insertion teeth are formed in the two electrodes, the shell is arranged outside the capacitor core in a sleeving mode, and the insertion teeth of the shell are inserted into the insertion holes of the electrodes to be matched in an inserted mode. And the interior of the shell and the capacitor core are packaged by using an epoxy resin potting material.

Description

technical field [0001] The invention relates to the technical field of film capacitors, in particular to a mounting type film capacitor and a manufacturing method thereof. Background technique [0002] In recent years, military electronic machines have been developing toward high performance, miniaturization, and light weight. The demand for surface-mounted organic film capacitors with small size, light weight, and excellent electrical performance is increasing day by day. Organic film capacitors are made of organic plastic film as the medium, metal foil or metallized film as the electrode, and are made by winding. At the same time, organic film capacitors have irreplaceable advantages in the application of stable high-frequency characteristics, large capacity, low ESR and ESL, high current, and high voltage. However, the currently used organic thin film capacitors are still relatively large in size, so it is difficult to meet the needs of miniaturized circuit element integ...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem that the organic film capacitor produced by the current production process is large in size, difficult to meet the integration requirements of miniaturized circuit components, and has poor temperature resistance, which is easy to cause cracking, the invention provides a mountable film capacitor. Capacitors are more miniaturized to meet the integration requirements of miniaturized circuit components

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