Method for separating copper-soldering tin mixture and device for achieving method

Abstract

The invention discloses a method for separating a copper-soldering tin mixture and a device for achieving the method. The method comprises the following steps that soldering tin in the copper-soldering tin mixture is melted into liquid through heating while copper in the copper-soldering tin mixture is still in a solid state; and centrifugal separation is conducted to enable the liquid soldering tin to be separated from the solid copper. The device comprises a heating unit and a centrifugation unit; the centrifugation unit comprises a rotary drum; the soldering tin in the copper-soldering tin mixture is melted into liquid through the heating unit while the copper in the copper-soldering tin mixture is still in the solid state; and the liquid soldering tin is separated from the solid copper through the centrifugation unit. According to the method for separating the copper-soldering tin mixture and the device for achieving the method, through the melting point difference of the copper-soldering tin mixture, separation of the copper-soldering tin mixture is achieved for the first time, and the method for separating the copper-soldering tin mixture and the device for achieving the method have the advantages of being convenient to operate, easy to achieve a large scale, low in cost, environmentally friendly and the like; and the method for separating the copper-soldering tin mixture and the device for achieving the method contribute greatly to achieving environmental friendliness for waste household appliances and achieve resource recovery of the copper-soldering tin mixture.

Description

technical field [0001] The invention relates to a recovery technology of a copper and solder mixture, in particular to a method for separating copper and solder mixture and a device for realizing the method. Background technique [0002] Nowadays, with the continuous improvement of people's living standards, the amount of waste home appliances is also increasing, and there are more and more recycling technologies for waste home appliances. One of the methods is to use the crushing method to separate and recycle waste circuit boards after being broken. . After pulverization, a mixture of copper and solder can be separated from it, but this mixture is currently difficult to directly recycle. Only after the solder and copper in it are separated can it be effectively recycled. Although there are related solder recovery and separation technologies in the prior art, for example: the patent application number 201110364496.7 published by the Chinese Patent Office on May 22, 2013, ...

AI Technical Summary

Problems solved by technology

Although there are related solder recovery and separation technologies in the prior art, for example: the patent application number 201110364496.7 published by the Chinese Patent Office on May 22, 2013, and the invention titled "Separation Device for Solder Recovery" discloses a separation device, but This invention can only separate the solder mixed with the components, but cannot separate the copper from it, let alone separate the solder from the copper

Because the state of solder and copper mixed together is very complicated, especially when solder powder and copper powder are mixed together, not only the specific gravity of the two is relatively close, but also the proportion and content of the two are very different, so it is impossible to realize them by using the existing technology. The separation of copper and solder mixture is urgently needed in this field, which is easy to operate, low in cost and environmentally friendly.

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