Method for separating copper-soldering tin mixture and device for achieving method

A mixture and solder technology, applied in the field of a method and a device for realizing the method, can solve the problems of inability to realize separation, inability to separate copper, inability to separate solder and copper, etc., and achieve resource recovery and easy scale. Achieving and easy-to-operate effects

Active Publication Date: 2017-05-24
江苏艾醍客能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are related solder recovery and separation technologies in the prior art, for example: the patent application number 201110364496.7 published by the Chinese Patent Office on May 22, 2013, and the invention titled "Separation Device for Solder Recovery" discloses a separation device, but This invention can only separate the solder mixed with the components, but cannot separate the copper from it, let alone separate the solder from the copper
Because the state of solder and copper mixed together is very complicated, especially when solder powder and copper powder are mixed together, not only the specific gravity of the two is relatively close, but also the proportion and content of the two are very different, so it is impossible to realize them by using the existing technology. The separation of copper and solder mixture is urgently needed in this field, which is easy to operate, low in cost and environmentally friendly.

Method used

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  • Method for separating copper-soldering tin mixture and device for achieving method
  • Method for separating copper-soldering tin mixture and device for achieving method
  • Method for separating copper-soldering tin mixture and device for achieving method

Examples

Experimental program
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Effect test

Embodiment 1

[0032] see figure 1 As shown: a device for separating copper and solder mixture through external heating provided in this embodiment includes a rotating drum 4 and an external heating ring 7 located outside the rotating drum 4, the rotating drum 4 is fixed on the rotating shaft 2, and the rotating shaft 2 passes through the bearing 3 Connected to base 1. A belt pulley 5 is installed on the lower end of the rotating shaft 2, and the belt pulley 5 is connected with the power unit (not shown). When the belt pulley 5 rotates under the drive of the power device, the drum 4 also rotates synchronously, and the copper and solder mixture 6 inside the drum 4 rotates at the same time. Under the heating action of the outer heating ring 7, the solder in it melts into liquid, Then it is thrown out from the drum 4 under the action of centrifugal force, so as to realize the separation from copper.

Embodiment 2

[0034] see figure 2 As shown: a device for separating copper and solder mixture through internal heating provided in this embodiment includes a drum 4 and an inner heating ring 8 located in the drum 4, and the inner heating ring 8 is suspended on the drum by an inner heating ring bracket 9 4, the copper and solder mixture 6 is heated by the inner heating ring 8, and the solder in it melts into a liquid, and then is thrown out from the drum 4 under the action of centrifugal force, thereby realizing the separation from the copper.

Embodiment 3

[0036] see image 3 As shown: a device for separating copper and solder mixture through internal and external heating provided in this embodiment includes a drum 4, an outer heating ring 7 located outside the drum 4 and an inner heating ring 8 located inside the drum 4, the copper Under the simultaneous heating of the outer heating ring 7 and the inner heating ring 8, the solder in the mixture 6 melts into a liquid, and then is thrown out from the drum 4 under the action of centrifugal force, thereby realizing the separation from the copper.

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PUM

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Abstract

The invention discloses a method for separating a copper-soldering tin mixture and a device for achieving the method. The method comprises the following steps that soldering tin in the copper-soldering tin mixture is melted into liquid through heating while copper in the copper-soldering tin mixture is still in a solid state; and centrifugal separation is conducted to enable the liquid soldering tin to be separated from the solid copper. The device comprises a heating unit and a centrifugation unit; the centrifugation unit comprises a rotary drum; the soldering tin in the copper-soldering tin mixture is melted into liquid through the heating unit while the copper in the copper-soldering tin mixture is still in the solid state; and the liquid soldering tin is separated from the solid copper through the centrifugation unit. According to the method for separating the copper-soldering tin mixture and the device for achieving the method, through the melting point difference of the copper-soldering tin mixture, separation of the copper-soldering tin mixture is achieved for the first time, and the method for separating the copper-soldering tin mixture and the device for achieving the method have the advantages of being convenient to operate, easy to achieve a large scale, low in cost, environmentally friendly and the like; and the method for separating the copper-soldering tin mixture and the device for achieving the method contribute greatly to achieving environmental friendliness for waste household appliances and achieve resource recovery of the copper-soldering tin mixture.

Description

technical field [0001] The invention relates to a recovery technology of a copper and solder mixture, in particular to a method for separating copper and solder mixture and a device for realizing the method. Background technique [0002] Nowadays, with the continuous improvement of people's living standards, the amount of waste home appliances is also increasing, and there are more and more recycling technologies for waste home appliances. One of the methods is to use the crushing method to separate and recycle waste circuit boards after being broken. . After pulverization, a mixture of copper and solder can be separated from it, but this mixture is currently difficult to directly recycle. Only after the solder and copper in it are separated can it be effectively recycled. Although there are related solder recovery and separation technologies in the prior art, for example: the patent application number 201110364496.7 published by the Chinese Patent Office on May 22, 2013, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B15/00C22B25/06
CPCY02P10/20
Inventor 王武生
Owner 江苏艾醍客能源科技有限公司
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