Comprehensive environment-friendly separation process for valuable metals of waste mobile phone circuit board
A valuable metal and circuit board technology, which is applied in the field of comprehensive environmental protection separation of valuable metals from waste mobile phone circuit boards, can solve the problems of resource waste, environment, personal safety, pollution, etc., and achieve recycling, significant social benefits, and advanced technology. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0030] A comprehensive and environmentally friendly separation process for valuable metals from waste mobile phone circuit boards. The main processes include shearing and crushing, magnetic separation, hammer milling and screening, wind separation and electrostatic separation, acid leaching, purification and impurity removal, copper sulfate crystallization, nitric acid Separation of silver, aqua regia and replacement of platinum and palladium, wherein the details of each process are as follows:
[0031] (1) Shearing and breaking:
[0032] Put the waste circuit board substrate separated from the IC components into the shear crusher, shear and crush until the particle size is below 20mm, and send the crushed scrap to the magnetic separator;
[0033] (2) Magnetic separation:
[0034] Carry out magnetic separation and separation of the crushed materials conveyed by the shearing crusher, and separate the ferromagnetic substances (iron powder) and non-magnetic materials. The iron p...
Embodiment 2
[0051] A comprehensive and environmentally friendly separation process for valuable metals from waste mobile phone circuit boards. The main processes include shearing and crushing, magnetic separation, hammer milling and screening, wind separation and electrostatic separation, acid leaching, purification and impurity removal, copper sulfate crystallization, nitric acid Separation of silver, aqua regia and replacement of platinum and palladium, wherein the details of each process are as follows:
[0052] (1) Shearing and breaking:
[0053] Put the waste circuit board substrate separated from the IC components into the shear crusher, shear and crush until the particle size is below 20mm, and send the crushed scrap to the magnetic separator;
[0054] (2) Magnetic separation:
[0055] Carry out magnetic separation and separation of the crushed materials conveyed by the shearing crusher, and separate the ferromagnetic substances (iron powder) and non-magnetic materials. The iron p...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap