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Magnetron sputtering machine and magnetron sputtering device

A magnetron sputtering and lifting rod technology, which is applied in sputtering coating, ion implantation coating, metal material coating process, etc., can solve the problems of low adjustment accuracy of the substrate to be formed and the mask plate.

Active Publication Date: 2017-05-31
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a magnetron sputtering table and a magnetron sputtering device, which avoids causing the substrate to be filmed to be separated from the The problem of low adjustment accuracy of the distance between masks

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  • Magnetron sputtering machine and magnetron sputtering device

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] Embodiments of the present invention provide a figure 1 Magnetron sputtering station 01 shown. The magnetron sputtering station 01 includes a mask plate 10 , a lifting mechanism 20 and a substrate 30 to be filmed. Wherein, the mask plate 10 such as figure 2 As shown, there are opening regions 101 and shielding regions 102 arranged at intervals.

[0034] Specifically, the substrate 30 to be filmed is located on the carrying surface of the lifting mec...

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Abstract

The embodiment of the invention provides a magnetron sputtering machine and a magnetron sputtering device and relates to the technical field of magnetron sputtering processes. The problem that only by adjusting the number of spacers between a mask plate and a supporting frame for supporting the mask plate, the adjusting precision of the distance between a substrate to be subjected to film formation and the mask plate is relatively low can be avoided. The magnetron sputtering machine comprises the mask plate, a lifting mechanism and the substrate to be subjected to film formation. The substrate to be subjected to film formation is located on a bearing face of the lifting mechanism, and the mask plate is located on the side, back onto the lifting mechanism, of the substrate to be subjected to film formation. The lifting mechanism is used for ascending or descending according to lifting instructions so that the distance between the substrate to be subjected to film formation and the mask plate can be adjusted.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering technology, in particular to a magnetron sputtering table and a magnetron sputtering device. Background technique [0002] Organic Light Emitting Diode (English full name: Organic Light Emitting Diode, English abbreviation: OLED), as a current-type light-emitting device, is becoming more and more popular because of its characteristics such as self-luminescence, fast response, wide viewing angle and the ability to be fabricated on flexible substrates. It is increasingly used in the field of high-performance display. [0003] For a large-sized OLED display, when the OLED device in the display is a top emission type, a transparent conductive material can be used as the cathode of the OLED device. The material constituting the transparent conductive layer may be IZO (English full name: Indium Zinc Oxide, Chinese full name: Indium Zinc Oxide) or IGZO (English full name: Indium Gallium Zin...

Claims

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Application Information

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IPC IPC(8): C23C14/04C23C14/35C23C14/50
CPCC23C14/042C23C14/35C23C14/50
Inventor 薛金祥孙中元周翔
Owner BOE TECH GRP CO LTD
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