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Inhibitor for copper electroplating, application of inhibitor and copper electroplating solution containing inhibitor

A technology of electroplating copper and inhibitor, applied in the field of inhibitor for electroplating copper and electroplating copper electroplating solution, can solve the problems such as the line width cannot be effectively controlled, the circular arc of the pattern electroplating line is large, and the short circuit can achieve good pattern electroplating effect. , the effect of reducing the arc

Inactive Publication Date: 2017-05-31
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the copper electroplating solution using traditional inhibitors is applied to the pattern electroplating process, the arc of the obtained pattern electroplating circuit is often large
However, if the arc is too high, the line width cannot be effectively controlled, and there is a risk of short circuit

Method used

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  • Inhibitor for copper electroplating, application of inhibitor and copper electroplating solution containing inhibitor
  • Inhibitor for copper electroplating, application of inhibitor and copper electroplating solution containing inhibitor
  • Inhibitor for copper electroplating, application of inhibitor and copper electroplating solution containing inhibitor

Examples

Experimental program
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Effect test

Embodiment 1

[0052] This embodiment provides polyacrylamide compounds substituted with dimethylamine derivatives, the structural formula of which is shown in Table 1 (wherein, n is an integer greater than or equal to 2, and an integer less than or equal to 500, for example taken from 450 ≥n≥20 or 400≥n≥300 integer), its synthetic route is as follows:

[0053]

[0054] Table 1: The compound structural formula that embodiment 1 provides

[0055]

[0056]

[0057] Preparation method of polymer P1

[0058] Under nitrogen protection, polyacrylamide (10g), N,N-dimethylethylenediamine (5g), deionized water (20mL) were added into a two-necked flask, and the temperature was raised to 70°C (60-80°C Any value in ℃) reacted for 36h (can be any value in 24-48h). The reaction solution was naturally cooled to room temperature to obtain polymer P1. 1 H NMR (400MHz, CDCl 3 )δ(ppm):4.8-4.4(br,1H),3.4-3.8(br,1H),2.6-2.0(br,6H)2.2-0.9(br,6H).GPC(THF):M n =38.4kDa,M w =59.2kDa, PDI=1.54. Element...

Embodiment 2

[0060] The reaction products in Table 2 were prepared in the same manner as in Example 1. The elemental analysis results of the reaction products are summarized in Table 2.

[0061] Table 2: Elemental analysis results of P2-P5

[0062]

Embodiment 3

[0064] By mixing 60 g / L copper sulfate pentahydrate as a copper source, 200 g / L sulfuric acid, 65 ppm chloride ion, 1 ppm sodium polydithiodipropane sulfonate, and 300 ppm polyethylene glycol 4000. The plating solution also contained 20 ppm of the reaction product P1 of Example 1 as an inhibitor.

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Abstract

The invention discloses an inhibitor for copper electroplating, an application of the inhibitor and a copper electroplating solution containing the inhibitor. The inhibitor is a polyacrylamide polymer substituted by a dimethylamine derivative, and the structural general formula of the inhibitor is as shown in the specification, wherein R represents an alkyl group or an alkoxy group, and n is an integer which is greater than or equal to 2. The invention provides the inhibitor. The inhibitor is used for preparing the copper electroplating solution, the copper electroplating solution is further applied to pattern electroplating for printed circuit boards, the arc degree of the pattern electroplating circuits can be remarkably reduced, and the good pattern electroplating effect is achieved.

Description

technical field [0001] The invention belongs to the field of electroplating copper technology, and in particular relates to an inhibitor for electroplating copper, its application and a copper electroplating solution containing the same. The electroplating copper inhibitor is a polyacrylamide compound substituted by dimethylamine, and is especially suitable for the graphic electroplating process of printed circuit boards. Background technique [0002] With the development of smart phones, tablet computers and wearable devices in the direction of miniaturization and multi-function, the technology of high-density interconnected printed circuit boards continues to improve, resulting in the width and spacing of printed circuit board conductors, the The diameter and hole center distance, as well as the thickness of the conductor layer and insulating layer are all decreasing. Miniaturization drives reductions in line width, spacing, and surface mount pad size within HDI printed w...

Claims

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Application Information

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IPC IPC(8): C25D3/38C08F120/56C08F8/32
CPCC25D3/38C08F8/32C08F120/56
Inventor 王溯李树岗
Owner SHANGHAI SINYANG SEMICON MATERIALS
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