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A fast qfn chip plastic package image acquisition and amplification method

An image acquisition and chip technology, applied in image analysis, image data processing, instruments, etc.

Active Publication Date: 2019-10-11
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are no documents and patents related to QFN chip plastic package image extraction and image amplification technology. Therefore, a fast QFN chip plastic package image extraction and amplification method is designed to fill the lack of research in this area. For subsequent high-precision QFN chips On-line detection of surface defects is particularly important

Method used

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  • A fast qfn chip plastic package image acquisition and amplification method
  • A fast qfn chip plastic package image acquisition and amplification method
  • A fast qfn chip plastic package image acquisition and amplification method

Examples

Experimental program
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Embodiment

[0055] To figure 2 (a)(d) (Grayscale images with dimensions of 2048*2048 and 220*220) as an example, the implementation steps are as follows:

[0056] Step 1, Image preprocessing of multiple plastic images

[0057] 1.1 Image filtering of multiple plastic images

[0058] In order to improve the chip segmentation effect and accuracy, and avoid various noise interference caused by the image acquisition process, firstly, the median filter processing with a filter window of 3*3 is performed on multiple plastic images, and the image after median filtering is used as the next step Input for image processing. Median filtering is essentially a statistical sorting filter. The median value of all pixels in the neighborhood centered on a certain pixel in the image is taken as the filtering output of the pixel. The calculation formula is as follows:

[0059] g(x,y)=med{f(x-k,y-l),(k,l∈W)}

[0060] Where f and g are the input pixel and output pixel values ​​respectively, and W is the neighborhood ...

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Abstract

The invention discloses a quick QFN chip plastic package image obtaining and amplifying method. The method comprises the following steps of (1) preprocessing a plurality of QFN plastic package images acquired by a visual detection system; (2) performing connected region marking and judgment on preprocessing results of the plastic package images, and extracting a single QFN plastic package image from a connected region meeting a condition; (3) preprocessing the extracted single plastic package image; (4) performing rotary correction on a preprocessing result of the single plastic package image; (5) performing quick image amplification on a rotary correction result of the single plastic package image; (6) if a non-extracted connected region meeting the condition also exists currently, entering the step (2), otherwise, ending the processing of the current QFN plastic package images, and entering the processing of next QFN plastic package images. The method provides a technical basis for high-precision online detection of surface defects of a QFN chip.

Description

Technical field [0001] The invention belongs to the field of image processing algorithm design, and specifically relates to a fast QFN chip plastic packaging image acquisition and amplification method. Background technique [0002] The QFN (Quad Flat No-leads) package in the prior art is a widely used semiconductor chip package form. During the production and packaging process, various types of defects, such as scratches, scratches, cracks, etc., are prone to occur on the surface of the QFN chip plastic package, which seriously affects the quality of the QFN chip. Therefore, it is necessary to perform necessary visual quality inspection on the plastic packaging surface of the QFN chip through inspection equipment, and this task is usually completed by an automated test sorting machine. During the visual quality inspection, a certain amount of QFN chips are carried by the tray and sent into the camera shooting area by the clamping and movement mechanism, such as figure 1 Shown. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06T7/13G06T7/187
Inventor 巢渊张志胜戴敏
Owner SOUTHEAST UNIV