Etching device

Abstract

The invention discloses a wet etching device. The wet etching device comprises an etching device body, a silicon substrate and an air pressure cavity. The etching device body is provided with an infrared absorption area, a frame, an etching opening, the silicon substrate, thermopiles, supporting arms, an etching chamber, protective glass, a control box, an alarm indicator light, nozzles, the air pressure cavity, an acid liquid cavity, a sprayer, a positioner and a liquid guide tube. A ventilation guide tube is arranged between the air pressure cavity and the acid liquid cavity, the acid liquid cavity is internally pressurized by the air pressure cavity through the ventilation guide tube to enable acid liquid to be sprayed out of the sprayer under a certain pressure, the acid liquid can be accurately sprayed to the silicon substrate to react with unnecessary parts to generate acid liquid water which is discharged, and a remaining part is a required monocrystalline silicon wafer after reaction.

Description

technical field [0001] The invention relates to the technical field of wet etching technology, in particular to an etching device. Background technique [0002] The wet etching process mainly refers to the etching technology that uses liquid chemicals to remove the etchant. Specifically, the chemical reaction between the etchant and the etchant changes the structure of the etchant so that there is no photoresist coverage. Part of the etched product is detached from the surface of the substrate, and the etched area covered by the photoresist is preserved, so that the desired pattern of the etched product is obtained on the substrate. [0003] Wet etching equipment generally uses acidic liquid in the wet etching tank to spray the substrate to be etched through nozzles, so as to achieve the purpose of etching. With the increase of the size of the substrate in the flat panel display industry, during the wet etching process, more and more chemical solutions are accumulated on th...

AI Technical Summary

Problems solved by technology

With the increase of the size of the substrate in the flat panel display industry, during the wet etching process, more and more chemical solutions are accumulated on the surface of the substrate, which makes the replacement of the chemical solution on the surface of the substrate worse, resulting in the engraving on the substrate. The uniformity of etch etching becomes poor, seriously affecting the yield of products

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