Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed circuit board and processing method

A technology of printed circuit boards and printed circuits, which is applied in the directions of printed circuits, printed circuit manufacturing, circuit board tool positioning, etc., can solve the problems of incomplete matching, inability to monitor, product scrapping, etc. Simple operation effect

Inactive Publication Date: 2017-05-31
GUANGZHOU MEADVILLE ELECTRONICS
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The laser drilling machine can only calculate the linear expansion and contraction deformation by measuring the coordinates of 4 targets on the board, but cannot monitor the arc-shaped expansion and contraction that occurs in the middle of the long side and wide side of the printed circuit board
Therefore, the output tool coefficient cannot completely match the actual deformation of the board, which will lead to the occurrence of blind hole chipping pad (soldering pad) defects in the middle of the long side and wide side of the board, resulting in product scrapping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and processing method
  • Printed circuit board and processing method
  • Printed circuit board and processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Below, in conjunction with accompanying drawing and specific embodiment, the present invention is described further:

[0034] Such as Figure 1-2 with Figure 4-5 As shown, a printed circuit board includes a top layer board 10, an inner layer board 20 and a bottom layer board 30 pressed together in sequence; the inner layer board 20 is divided into two parts, which are respectively marked as the middle square drilling area 21 and the alignment area 22 , the alignment area 22 surrounds the square drilling area 21 in the middle; the printed circuit board is provided with at least one alignment target hole 50, and the alignment target hole 50 passes through the top layer board 10, alignment District 22 and bottom plate 30; eight alignment targets 40 are arranged on the square drilling area 21 in the middle; wherein, four alignment targets 40 are respectively arranged on the four corners of the square drilling area 21 in the middle, and the other four alignment targets Th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a printed circuit board and processing method. The printed circuit board comprises a pressed top board, an inner plate and a bottom plate in sequence. The inner plate is divided into a middle square drilling area and a contraposition area. The printed circuit board is provided with a contraposition target hole. The target hole passes is through the top plate, the alignment area and the bottom plate. The middle square drilling area is provided with eight contraposition targets, wherein, the four contraposition targets are respectively arranged at four corners of the middle square drilling area in the middle and the other four contraposition targets are respectively arranged on the four sides of the middle square drilling area. The system can accurately read the collapsible deformation information system of board integrity, reducing the blind hole at the bottom of the pad collapse defect. The printed circuit board and processing method also disclose a processing method of the printed circuit board, which is simple in operation and can improve the pad defect of the blind hole bottom.

Description

technical field [0001] The present invention relates to the technical field of printed circuit board (PCB), in particular to a printed circuit board and a processing method thereof. Background technique [0002] Printed circuit boards are the providers of electrical connections for electronic components. As the circuit of the printed circuit board becomes more and more complicated, a high density interconnection (High Density Interconnector, HDI) technology emerges at the historic moment, resulting in a high density interconnection printed circuit board (HDI board). The HDI board adds additional layers to the multi-layer circuit board, and makes micro-blind holes by laser drilling to realize interlayer interconnection. In the production process of HDI board, alignment is a key factor affecting the alignment of laser blind holes. [0003] In addition, expansion and contraction deformation is a chronic disease that is difficult to overcome for printed circuit boards. The cu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0266H05K3/0008H05K2203/163
Inventor 陈冬弟何罗生符唐盛
Owner GUANGZHOU MEADVILLE ELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com