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A stacking device and stacking method for preventing copper foil from wrinkling

A copper foil and board stacking technology is applied in the field of lamination device for preventing copper foil wrinkling by laminating and arranging the printed circuit board, and can solve the problems of poor appearance, copper foil wrinkling, poor conductivity, etc. Achieve the effect of preventing poor continuity or poor appearance and avoiding wrinkles

Active Publication Date: 2019-04-02
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Therefore, the technical problem to be solved by the present invention is that the existing automatic stacking device is easy to cause the copper foil to wrinkle when clamping the copper foil, resulting in poor conductivity or poor appearance. Plate device and stacking method

Method used

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  • A stacking device and stacking method for preventing copper foil from wrinkling
  • A stacking device and stacking method for preventing copper foil from wrinkling
  • A stacking device and stacking method for preventing copper foil from wrinkling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] This embodiment provides a stacking device that prevents copper foil from wrinkling, such as figure 1As shown, the device includes a frame 1, a first driving device 2 connected to the frame 1 for driving the movement of the frame 1, and the first driving device 2 is connected to the frame 1 The top, which includes a conventional servo motor and a reducer, the first driving device 2 plays a role in driving the frame 1 to move in the directions of X, Y, and Z axes, and a feeding table is arranged below the frame 1, so The materials to be picked and placed are placed on the above-mentioned loading table. A group of manipulators 3 are installed on the frame 1, and the manipulators 3 are arranged at the bottom of both ends of the frame 1, and are used to clamp the three-layer composite structure of copper foil-steel plate-copper foil, which forms a "sandwich" The bottom of both ends of the frame 1 is also provided with a group of clamping mechanisms 4, the clamping mechanis...

Embodiment 2

[0039] This embodiment provides a stacking device that prevents copper foil from wrinkling, such as figure 1 As shown, the device includes a frame 1, a first driving device 2 connected to the frame 1 for driving the movement of the frame 1, and the first driving device 2 is connected to the frame 1 The top, which includes a conventional servo motor and a reducer, the first driving device 2 is used to drive the frame 1 to move in the directions of X, Y, and Z axes. A group of manipulators 3 are installed on the frame 1, and the manipulators 3 are arranged at the bottom of both ends of the frame 1, and are used to clamp the three-layer composite structure of copper foil-steel plate-copper foil, which forms a "sandwich" The bottom of both ends of the frame 1 is also provided with a group of clamping mechanisms 4, the clamping mechanisms 4 are arranged in parallel with the manipulator 3, and are all arranged at both ends of the bottom of the frame 1. The holding mechanism 4 plays...

Embodiment 3

[0046] This embodiment provides a stacking method for preventing copper foil from wrinkling, which includes the following steps:

[0047] S1. Provide a copper foil-steel plate-copper foil three-layer "sandwich" composite structure, and transport the composite structure to the loading table below the frame 1;

[0048] S2. Control the manipulator 3 to grip the top and bottom of the composite structure, grab the entire composite structure, and control the clamping mechanism 4 to grip the top of the top copper foil and the bottom of the steel plate in the composite structure, and also control the vacuum suction mechanism to absorb the top of the composite structure;

[0049] S3. Use the driving mechanism to control the movement of the frame 1 in the three directions of X, Y, and Z axes, transport the frame 1 to the top of the semi-finished PCB board, and release the manipulator;

[0050] S4. Release the clamping mechanism 0.5-1 second after the manipulator is released, so that th...

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Abstract

The invention provides a plate laminating device for preventing copper foils from corrugating. The plate laminating device comprises a frame, and a group of manipulators arranged at the bottom of two ends of the frame and used for clamping a material, wherein a group of clamping mechanisms is further arranged at the bottom of the two ends of the frame, and the clamping mechanisms are parallel to the manipulators. Further provided is a plate laminating method for preventing copper foils from corrugating. In the device and the method, the manipulators are used for clamping the top and bottom of a copper foil-steel plate-copper foil composite structure, the clamping mechanisms are used for clamping the top two layers of materials, i.e., the top copper foil and the steel plate, but not clamping the bottom copper foil, the manipulators are loosened first during discharging, and the clamping mechanisms are loosened after a time interval, thereby solving the problem that the bottom copper foil to which pressure is applied by the steel plate under the action of gravity after the manipulators are loosened is corrugated; and the clamping mechanisms are loosened after a period of time when the manipulators are loosened, so that the effect of further flattening the bottom copper foil can be achieved, the bottom copper foil is effectively prevented from corrugating, and poor conductivity or poor appearance of a laminated PCB (Printed Circuit Board) is prevented.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and relates to a pressing and arranging process of printed circuit boards, in particular to a board stacking device and a board stacking method for preventing copper foil from wrinkling. Background technique [0002] The development of the PCB (Printed Circuit Board, Printed Circuit Board) industry is an important basis for the development of the information industry. FPC, after more than 60 years, can be made into an electronic device with strong circuit conduction, connection performance and other electronic properties by making a circuit on a small copper clad board and then pasting some circuit components. product. Almost every electronic product, from small electronic watches and calculators to large computers and communication equipment, as long as there are electronic components, the electrical interconnection between them depends on printed circuit boards. [0003] The pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46B65G47/91
CPCB65G47/91H05K3/46H05K2203/06
Inventor 邓辉季辉樊锡超
Owner SHENZHEN SUNTAK MULTILAYER PCB