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Conductive composition and electronic component using same

一种组合物、导电性的技术，应用在导电粘合剂、分散在不导电无机材料中的导电材料、导电材料等方向，能够解决接合界面剥离、接合部弹性模量变大、接合部变硬等问题，达到维持接合强度、弹性模量变小、抑制破裂的效果

Active Publication Date: 2017-05-31
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, the size of semiconductor elements has become smaller, and with the reduction in size of semiconductor elements, it has become more difficult to control the thickness by applying a load to the semiconductor element
[0004] In addition, the elastic modulus of the joint portion increases due to sintering of the silver particles in the paste, in other words, the joint portion becomes hard, and the joint portion cannot follow the temperature change caused by repeated use of the electronic component using the semiconductor element. Cracks in semiconductor elements, cracks in joints, peeling of joint interfaces, etc.

Method used

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  • Conductive composition and electronic component using same
  • Conductive composition and electronic component using same
  • Conductive composition and electronic component using same

Examples

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Comparison scheme
Effect test

Embodiment

[0119] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples.

[0120] Analysis in Examples was performed as follows.

[0121] (1) Determination of silver particles and metal particles

[0122] (1-1) Number average particle size

[0123] 0.5 g of silver fine particles or 0.5 g of metal particles was added to 50 cc of dispersion water (water containing 0.5% of AEROSOL manufactured by Beckmann Coulter), and dispersed for 5 minutes with an ultrasonic disperser. The number average particle diameter of the dispersed sample was measured by laser diffraction scattering particle size distribution measurement (LS230 manufactured by Beckmann Coulter). Based on the number basis, the number average particle diameter of the primary particles was obtained.

[0124] (1-2) Crystallite size

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Abstract

The invention provides: a conductive composition which is capable of forming a bonding part where the bonding strength is able to be maintained, while maintaining the thickness thereof; and an electronic component which uses this conductive composition. The invention is a conductive composition which contains (A) silver fine particles that have a number average particle diameter of primary particles of 40-400 nm, (B) a solvent and (C) thermoplastic resin particles that have the maximum endothermic peak within the range of 80-170 DEG C in a DSC chart obtained by measurement using a differential scanning calorimeter. It is preferable that the maximum endothermic peak of the thermoplastic resin particles (C) is within the range of 110-140 DEG C in the DSC chart obtained by measurement using a differential scanning calorimeter.

Description

technical field [0001] The present invention relates to a conductive composition and an electronic component using the conductive composition. Background technique [0002] A paste containing silver particles is heated to sinter silver particles to form a conductive silver film, and the paste is used to form conductive circuits on circuit boards constituting semiconductor devices, electrodes of capacitors, and the like. In recent years, pastes containing silver particles have also been used to form junctions of semiconductor devices such as bumps and die attach materials. [0003] However, when the paste is used to form a joint portion of a semiconductor device or the like, the volume of the paste shrinks due to the sintering of silver particles in the paste, and the thickness of the joint portion between the semiconductor element and the substrate becomes small, making it difficult to There is a problem of obtaining sufficient bonding strength. Moreover, when forming a ju...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/12C08K3/08H01B1/00H01B1/22
CPCC08K3/08C08L101/12H01B1/22H01L2224/8384H01L2224/32227H01L2224/29499H01L2224/83851H01L2224/2732H01L2224/83097H01L24/29H01L24/32H01L24/83H01L2224/29364H01L2224/29347H01L2224/2939H01L2224/29369H01L2224/29355H01L2224/29339H01L2224/29344H01L2224/29639H01L2224/29294H01L2224/29286C08L67/00C08L83/04C09D163/00C08L83/00C09D167/00H01L2924/00014H01L2924/013H01L2924/01079H01L2924/01047H01L2924/0105H01L2924/066H01L2924/0675H01L2924/068H01L2924/01029H01L2924/0715H01L2924/01046H01L2924/0695H01L2924/061H01L2924/0665H01L2924/01028H01L2924/069H01L24/28C08K2003/0806C08K2201/005C08K2201/001C09J171/00C09J163/00C09J183/00C08K2201/003C08L2203/20C09J9/02C09J11/06C09J167/00H01L2224/29239H01L2924/07001H01L2924/35121
Inventor 佐佐木幸司水村宜司
Owner NAMICS CORPORATION
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