Conductive composition and electronic component using same

Abstract

The invention provides: a conductive composition which is capable of forming a bonding part where the bonding strength is able to be maintained, while maintaining the thickness thereof; and an electronic component which uses this conductive composition. The invention is a conductive composition which contains (A) silver fine particles that have a number average particle diameter of primary particles of 40-400 nm, (B) a solvent and (C) thermoplastic resin particles that have the maximum endothermic peak within the range of 80-170 DEG C in a DSC chart obtained by measurement using a differential scanning calorimeter. It is preferable that the maximum endothermic peak of the thermoplastic resin particles (C) is within the range of 110-140 DEG C in the DSC chart obtained by measurement using a differential scanning calorimeter.

Description

technical field [0001] The present invention relates to a conductive composition and an electronic component using the conductive composition. Background technique [0002] A paste containing silver particles is heated to sinter silver particles to form a conductive silver film, and the paste is used to form conductive circuits on circuit boards constituting semiconductor devices, electrodes of capacitors, and the like. In recent years, pastes containing silver particles have also been used to form junctions of semiconductor devices such as bumps and die attach materials. [0003] However, when the paste is used to form a joint portion of a semiconductor device or the like, the volume of the paste shrinks due to the sintering of silver particles in the paste, and the thickness of the joint portion between the semiconductor element and the substrate becomes small, making it difficult to There is a problem of obtaining sufficient bonding strength. Moreover, when forming a ju...

AI Technical Summary

Problems solved by technology

However, in recent years, the size of semiconductor elements has become smaller, and with the reduction in size of semiconductor elements, it has become more difficult to control the thickness by applying a load to the semiconductor element

[0004] In addition, the elastic modulus of the joint portion increases due to sintering of the silver particles in the paste, in other words, the joint portion becomes hard, and the joint portion cannot follow the temperature change caused by repeated use of the electronic component using the semiconductor element. Cracks in semiconductor elements, cracks in joints, peeling of joint interfaces, etc.

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