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Package structure and its manufacturing method

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, acquisition/organization of fingerprints/palmprints, etc., can solve the problem of shortening the service life of fingerprint image sensors, and making the surface of the sensing area 110 easy to damage and other problems to avoid failure

Active Publication Date: 2022-07-15
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0007] However, the silicon crystal fingerprint image sensor needs to directly touch the sensing area 110 of the sensing chip 11 with a finger, so the surface of the sensing area 110 is easily damaged, thus shortening the service life of the existing fingerprint image sensor

Method used

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  • Package structure and its manufacturing method
  • Package structure and its manufacturing method
  • Package structure and its manufacturing method

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Embodiment Construction

[0040] The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0041] It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. Therefore, it does not have technical substantive significance. Any modification of structure, change of proportional rela...

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Abstract

A package structure and a manufacturing method thereof, the package structure includes: a substrate, an electronic component embedded in the substrate and having a sensing surface, and an insulating layer formed on the substrate and the sensing surface, through the insulating layer The sensing surface of the electronic component is covered to prevent fingers from directly touching the sensing area, so that the problem of failure of the electronic component due to damage to the sensing surface can be avoided.

Description

technical field [0001] The present invention relates to a package structure, in particular to a package structure of a fingerprint sensor and a manufacturing method thereof. Background technique [0002] With the improvement of living standards, consumers pay more and more attention to privacy. Many high-end electronic products are equipped with identification systems to increase the security of data in electronic products. Therefore, the development and design of identification systems also follow consumers Demand has become the development direction of the electronics industry. [0003] Today's identification systems are mainly developed towards biometric systems. In the biometric identification system, according to the different identification targets, it can be divided into two types of biometric identification systems that identify biological characteristics (such as fingerprints, pupils, faces, voiceprints) and behavioral characteristics (such as signatures, voices). ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06V40/13H01L23/31H01L21/56
CPCH01L21/56H01L23/3128G06V40/1306G06V40/1329H01L2224/92H01L2224/97H01L2224/48091H01L2924/00014
Inventor 唐绍祖蔡岳颖蔡瀛洲
Owner SILICONWARE PRECISION IND CO LTD
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