Electronic product shell and manufacture method thereof

A technology for electronic products and manufacturing methods, which is applied in the field of electronic product shells and their manufacturing with thermosetting resins as raw materials. It can solve the problems of long curing time of epoxy resin, uneven internal stress of materials, high cost of raw materials, etc., and achieve the apparent quality of products. Good, good molding process, good uniformity

Inactive Publication Date: 2017-06-13
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, this material also has obvious deficiencies, such as high cost of raw materials, uneven internal stress and easy deformation of the material, too long curing time of epoxy resin, and the molding of this material cannot realize more complex internal structural parts (such as screw columns, buckles, etc.) , ribs), it needs to be realized through subsequent methods such as bonding with the plastic frame or insert molding, which increases additional processes and reduces production efficiency

Method used

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  • Electronic product shell and manufacture method thereof
  • Electronic product shell and manufacture method thereof
  • Electronic product shell and manufacture method thereof

Examples

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Embodiment Construction

[0044] figure 1 An exploded view showing a layup design of an electronic product according to the present disclosure. According to the first embodiment of the present disclosure, an electronic product housing is proposed, which includes a chopped prepreg sheet 1 and a continuous prepreg sheet 2 and the continuous prepreg sheet 2 and the continuous prepreg sheet are formed by using a compression molding method. The chopped prepreg sheets 1 are bonded together and made after curing, as figure 2 shown.

[0045] The chopped prepreg sheet 1 includes chopped fibers including carbon fibers or glass fibers and a thermosetting resin. The thermosetting resin is, for example, a thermosetting epoxy resin.

[0046] The content of the chopped fibers is between 20% and 50%; the length of the chopped fibers ranges from 3 to 30 mm; the thickness of the chopped prepreg sheet is between 1 and 5 mm.

[0047] The continuous prepreg sheet 2 comprises continuous fibers comprising carbon fibers ...

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Abstract

The invention relates to an electronic product shell. The shell is manufactured by combining and curing a continuous prepreg sheet material and a short-cut prepreg sheet material by adopting a compression molding method. The invention further relates to a method for manufacturing the electronic product shell.

Description

technical field [0001] The disclosure relates to an electronic product casing and a manufacturing method thereof, in particular to an electronic product casing using a continuous prepreg sheet combined with chopped prepreg sheet reinforced thermosetting resin as a raw material and a manufacturing method thereof. Background technique [0002] At present, the development trend of consumer electronics products is lighter and thinner. Under this trend, more and more brand manufacturers use composite materials to manufacture electronic product casings. For example, Thinkpad, Sony, Dell, etc. have all launched products made of continuous carbon fiber reinforced epoxy resin composite materials. This continuous fiber reinforced thermosetting resin sheet has the characteristics of light weight and high strength, and has made outstanding contributions to the lightening and thinning of products. [0003] However, this material also has obvious deficiencies, such as high cost of raw ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/04B32B17/06B32B27/08B32B27/12B32B27/18B32B27/38B32B17/02B32B9/00B32B37/10
CPCB32B17/064B32B5/02B32B9/045B32B9/047B32B17/067B32B27/08B32B27/12B32B27/18B32B27/38B32B37/10B32B2262/106B32B2262/101B32B2307/714B32B2307/50B32B2307/306B32B2457/00
Inventor 孙岷
Owner LENOVO (BEIJING) CO LTD
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