Unlock instant, AI-driven research and patent intelligence for your innovation.

A MCU chip architecture system

A chip and processing chip technology, applied in transmission systems, architectures with a single central processing unit, instruments, etc., to shorten the time to market, realize firmware upgrades, and maximize flexibility

Active Publication Date: 2020-11-03
SINO WEALTH ELECTRONICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, whether it is for the SoC method or the SIP method, it is necessary to add a corresponding wireless communication module on the basis of the original MCU architecture, that is, to redesign a new MCU. This design cycle is usually 9 to 18 months, and new products may be due to Factors such as process replacement and redesign, and stability also need time to verify
Therefore, the rapid launch of a stable wireless MCU chip solution is an opportunity and a challenge for MCU design companies

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A MCU chip architecture system
  • A MCU chip architecture system
  • A MCU chip architecture system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The detailed features and advantages of the present invention are described in detail below in the specific embodiments, the content of which is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the specification, claims and drawings disclosed in this specification , those skilled in the art can easily understand the related objects and advantages of the present invention.

[0047]MCU chips for Internet of Things applications often require radio frequency wireless communication modules, and Internet of Things applications involve all walks of life, and the functions and types of MCUs required are various, some require high voltage, and some require low power consumption. , there is a need for high speed, MCUs in different applications often need to use different processes to achieve the most suitable performance and cost, and the realization of radio frequency mod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an MCU (microprogrammed control unit) chip architecture system which comprises a specialized wireless processing chip and a main MCU chip. The specialized wireless processing chip and the main MCU chip are packaged together through an SIP (system in package) mode; the specialized wireless processing chip and the main MCU chip perform data communication and control through a UART (universal asynchronous receiver / transmitter) interface; the specialized wireless processing chip and the main MCU chip adopt the same JTAG (joint test action group) debug interface mode and are tied on the same group of pins packaged by the SIP through binding wires to achieve sharing; a radio-frequency antenna of the specialized wireless processing chip is tied to corresponding pins packaged by the SIP through the binding wires to be lead out; other functional pins of the specialized wireless processing chip and the main MCU chip are respectively tied to the pins packaged by the SIP through the binding wires as required.

Description

technical field [0001] The invention relates to the field of integrated circuit chips, in particular to an MCU chip architecture. Background technique [0002] With the rise of the Internet of Things, various applications have begun to put forward the demand for networking, and the corresponding MCU chip industry has also begun a new round of vigorous development. Whether it is a traditional electronic device or a newly emerging smart device, under the tide of Internet of Things applications, there is a requirement for MCU chips to have wireless connection functions. Compared with traditional solutions that use MCU chips and wireless communication chips together, single MCU chip products integrated with radio frequency functions have obvious cost advantages while meeting the networking needs of various applications. [0003] There are mainly two architectures for the realization of a single MCU chip with wireless functions: one is SoC design, that is, the entire MCU product...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F15/78H04B1/40
CPCG06F15/7807H04B1/40
Inventor 张钦
Owner SINO WEALTH ELECTRONICS