Polypropylene thin film capacitor applicable to surface mounting

A polypropylene film and surface mounting technology, applied in the field of capacitors, can solve the problems that affect the performance of polypropylene film capacitors, the potting material cannot effectively absorb heat, and cannot be mounted on the surface, so as to prevent delamination, prevent separation, Easy to operate effect

Active Publication Date: 2017-06-13
XIAMEN FARATRONIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But the polypropylene film capacitor of prior art can't be used for surface mounting, and this is because the potting compound in the polypropylene film capacitor of prior art can not absorb heat effectively, the heat that conducts on the polypropylene film during reflow soldering , will cause the film to melt, and the plastic case will deform and crack, thus affecting the performance of polypropylene film capacitors

Method used

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  • Polypropylene thin film capacitor applicable to surface mounting
  • Polypropylene thin film capacitor applicable to surface mounting
  • Polypropylene thin film capacitor applicable to surface mounting

Examples

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Effect test

Embodiment 1

[0020] see figure 1 Shown, a kind of polypropylene film capacitor that is used for surface mounting of the present invention comprises polypropylene film capacitor core, plastic housing 1 and is filled in the potting body between polypropylene film capacitor core and housing; So The potting body is formed after potting with a prefabricated potting compound; the prefabricated potting compound is formed by adding 50% organic crystalline engineering plastic powder or granules based on the conventional potting compound to the conventional potting compound, It is obtained after being evenly stirred by a mixer, so as to realize temperature clamping by using the heat entropy value of organic crystalline engineering plastics, and fully absorb the heat transmitted to the core at the moment of reflow soldering;

[0021] The conventional potting compound includes the following components and parts by weight:

[0022]

[0023] Further, the prefabricated potting compound also includes ...

Embodiment 2

[0033] A kind of polypropylene film capacitor that is used for surface mounting of the present invention, differs from embodiment 1 in that, described prefabricated potting compound is to add 10% based on conventional potting compound in conventional potting compound Organic crystalline engineering plastic powder or granules.

Embodiment 3

[0035] A polypropylene film capacitor for surface mounting of the present invention differs from Embodiment 1 in that the prefabricated potting compound is added with 25% of the conventional potting compound as the base in the conventional potting compound Organic crystalline engineering plastic powder or granules.

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Abstract

The invention discloses a polypropylene thin film capacitor applicable to surface mounting. The polypropylene thin film capacitor comprises a polypropylene thin film capacitor core, a plastic shell and an encapsulating body which is arranged in the space between the polypropylene thin film capacitor core and the plastic shell in a filling way; the encapsulating body is formed by a prefabricated encapsulating material through an encapsulating way; the prefabricated encapsulating material is obtained by the steps of adding 10-80% of organic crystal type engineering plastic powder or granules into conventional encapsulating material by taking the conventional encapsulating material as a cardinal number, and then performing uniform stirring by a stirrer; and temperature clamp is realized by the thermal entropy value of the organic crystal type engineering plastic, so that heat conducted to the core at the moment of reflow soldering can be fully absorbed. By improving the encapsulating material and the capacitor structure, the effects of full heat insulation, heat absorption and uniform heating in the reflow soldering can be realized; therefore, the polypropylene thin film capacitor can be applicable to satisfying of the surface mounting technological requirement, particularly the lead-free surface mounting technological requirement; and the polypropylene thin film capacitor has the advantages of high temperature reflow soldering resistance, low cost, easy operation, high efficiency, high reliability and easy popularization.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a polypropylene film capacitor for surface mounting. Background technique [0002] Capacitors are one of the electronic components widely used in electronic equipment, and are widely used in DC blocking, coupling, bypass, filtering, tuning loops, energy conversion, control circuits, etc. [0003] Surface mount technology (SMT) is a systematic and comprehensive technology including design and manufacture of components, materials, equipment, processes, and surface mount circuit substrates. It is widely used in communications, computers, home appliances and other industries. With the promotion of surface mount technology, there is an imminent requirement for capacitors to withstand short-term high temperatures. In the field of lighting and home appliances, polypropylene film capacitors are widely used in high-frequency, DC, AC and pulse circuits. The characteristics of polypropy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224H01G4/33C08L23/06C08L23/12C08L67/02C08L81/02C08L77/00C08L63/00
CPCC08L23/06C08L23/12C08L63/00C08L67/02C08L77/00C08L81/02C08L2203/206H01G4/224H01G4/33
Inventor 王天祥林骁恺陈文耀
Owner XIAMEN FARATRONIC
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