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Method for manufacturing structural circuit integrated part based on fused deposition modelling technology

A technology of fused deposition forming and manufacturing method, applied in the field of 3D printing, can solve the problems of inability to process complex three-dimensional conductive channels from structural components, and achieve the effects of assembly-free, short production cycle and simple process

Active Publication Date: 2017-06-20
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that complex three-dimensional conductive channels cannot be processed inside structural components in the prior art, and to invent a method for manufacturing structural and circuit integrated components based on fused deposition forming technology

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  • Method for manufacturing structural circuit integrated part based on fused deposition modelling technology
  • Method for manufacturing structural circuit integrated part based on fused deposition modelling technology
  • Method for manufacturing structural circuit integrated part based on fused deposition modelling technology

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Embodiment Construction

[0028] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

[0029] Such as Figure 1-3 shown.

[0030] A method for manufacturing a structure-circuit integrated component based on fused deposition modeling technology, specifically including the following steps:

[0031] (1) Use the 3D modeling software in the computer to establish the 3D model of the structural circuit integration components to be processed, such as figure 2 As shown, thin-walled circular tubes are used to replace the positions where conductive channels need to be arranged. The inner diameter of the thin-walled circular tubes is 0.5-2mm, and the wall thickness does not exceed 0.5mm. After the modeling is completed, it is saved as an STL file.

[0032] (2) Import the 3D model into ...

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Abstract

The invention a method for manufacturing a structural circuit integrated part based on a fused deposition modelling technology. The method is characterized by comprising the following steps: first, establishing a three-dimensional model, reserving a conductive channel position, realizing separated sprinting of a structural part single-layer substrate and a conductive channel outer edge by utilizing a double-spraying head fused deposition machine tool, scanning to activate the outer edge of the conductive channel by using third-harmonic generation Nd:YAG laser out of the machine tool, and circulating layer by layer in such manner to complete the modelling of the solid body of the part; finally, performing electroplating on the solid body in a copper plating solution so that the reserved conductive channel is filled with metal copper, and completing machining. According to the method, integrated printing of a complex three-dimensional circuit of the structural part can be realized; the process is simple; the assembling is avoided; the method has a good application prospect in the fields of aerospace and precise electronics and electrical appliances.

Description

technical field [0001] The present invention relates to a 3D printing technology, in particular to a 3D-MID technology for interconnecting three-dimensional models, and in particular to a method for manufacturing structural and circuit integrated components based on fused deposition forming technology. Background technique [0002] Three-dimensional model interconnection 3D-MID (abbreviation for Three-dimensional Molded Interconnect Device) technology is to make wires and graphics with electrical functions on the injection-molded plastic shell, so as to integrate the electrical interconnection function of ordinary circuit boards, The function of supporting components and the supporting and protecting functions of the plastic shell are implemented on one device, forming a three-dimensional circuit carrier integrating electromechanical functions, that is, a three-dimensional molded interconnect device. It has been applied in automobile, industry, computer, communication and ot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/118B33Y10/00B33Y80/00C25D3/38C25D5/56C25D5/02
CPCB33Y10/00B33Y80/00C25D3/38C25D5/02C25D5/56
Inventor 沈理达严惠谢德巧梁绘昕田宗军邱明波
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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