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Fabrication method of structural and circuit integrated components based on laser selective area sintering technology

A technology of laser selective sintering and manufacturing methods, which is applied in the field of 3D printing technology, can solve the problems of cumbersome process flow and generation of complex three-dimensional conductive channels, etc., and achieve the effects of simple process, free assembly, and short production cycle

Active Publication Date: 2019-11-12
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0005] The purpose of the present invention is to address the cumbersome process flow in the production of existing structural circuits, which can only generate simple two-dimensional conductive channels on the surface of parts, but cannot generate complex three-dimensional conductive channels inside the structural parts, and the spatial three-dimensional structure needs to be assembled to complete To solve the circuit problem, provide a method for manufacturing structural and circuit integrated components based on laser selective sintering technology

Method used

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  • Fabrication method of structural and circuit integrated components based on laser selective area sintering technology
  • Fabrication method of structural and circuit integrated components based on laser selective area sintering technology
  • Fabrication method of structural and circuit integrated components based on laser selective area sintering technology

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Embodiment Construction

[0029] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

[0030] like Figure 1-3 shown.

[0031] A method for manufacturing a structure-circuit integrated component based on laser selective sintering technology, which specifically includes the following steps:

[0032] (1) Use the 3D modeling software in the computer to establish the 3D model 4 of the structural circuit integration components to be processed, such as figure 2 As shown, the position where the conductive channel needs to be arranged is replaced by a hollow cylinder with a diameter of 2 mm. After the modeling is completed, it is saved as an STL file.

[0033] (2) Import the 3D model into the slicing software to add support, layered slicing, path planning, and parameter selection; ...

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Abstract

A manufacturing method of structural and circuit integrated components based on laser selective sintering technology, which is characterized in that firstly, a three-dimensional model of the required processing parts is established and introduced into a laser selective sintering machine tool with a double vibrating mirror system, and the CO2 laser on the machine tool is used to Scan the molten powder raw material, and use triple frequency Nd: YAG laser scanning to expose the metal atoms at a specific position, so as to complete the forming process of the component substrate, and then put the processed substrate into the chemical plating solution for copper plating or nickel plated. The method of the invention can realize the three-dimensional printing of complex circuits in structural components, and has good application prospects in the fields of aerospace and precision electronic appliances.

Description

technical field [0001] The present invention relates to a 3D printing technology, in particular to a technology for manufacturing structural and circuit integrated components using 3D printing technology, specifically a method for manufacturing structural and circuit integrated components based on laser selective sintering technology. Background technique [0002] Structural circuit integrated components refer to special parts with specific structural shapes and complex conductive channels distributed inside. With the continuous development of science and technology, people have increasingly high requirements for lightweight products, especially in the aerospace field, technicians are still striving to reduce the weight of aircraft by one gram. Structural and circuit integrated components have given people new ideas in terms of light weight and reduced assembly difficulty. It has both structural support and wire harness conductive functions, and can completely optimize the e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/105B22F3/24B33Y10/00B33Y80/00
CPCB22F3/24B33Y10/00B33Y80/00B22F2003/242B22F10/00B22F10/62B22F10/36B22F12/49B22F10/66B22F10/68B22F12/17B22F10/34B22F10/28Y02P10/25
Inventor 田宗军谢德巧严惠梁绘昕沈理达邱明波
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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