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Fabrication method of structure-circuit integrated component based on stereolithography forming technology

A stereolithography and forming technology, applied in the field of 3D printing, can solve the problems of unable to structure parts and generate complex three-dimensional conductive channels, etc., and achieve the effects of short production cycle, free assembly and simple process

Active Publication Date: 2019-05-03
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem in the prior art that there is no method for generating complex three-dimensional conductive channels inside structural parts, and to invent a method for manufacturing structural and circuit integrated components based on stereolithography technology

Method used

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  • Fabrication method of structure-circuit integrated component based on stereolithography forming technology
  • Fabrication method of structure-circuit integrated component based on stereolithography forming technology
  • Fabrication method of structure-circuit integrated component based on stereolithography forming technology

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Embodiment Construction

[0028] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

[0029] Such as Figure 1-3 as shown,

[0030] A method for manufacturing a structure-circuit integrated component based on stereolithography technology. In an embodiment, the specific steps are as follows:

[0031] (1) Use the 3D modeling software in the computer to establish the 3D model of the structural circuit integration components to be processed, such as figure 2 As shown, the position where the conductive channel needs to be arranged is replaced by a round hole with a diameter of 2mm. After the modeling is completed, it is saved as an STL file.

[0032] (2) Import the 3D model into the slicing software for layered slicing and parameter setting. The exposure time is 10-20 seconds. ...

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Abstract

A manufacturing method of a structure-circuit integrated component based on stereolithography forming technology, which is characterized by first establishing a three-dimensional model, reserving the spatial position of a conductive channel in the three-dimensional model, importing it into a stereolithography forming machine tool, and using laser The surface imaging method solidifies the organic metal composite liquid material layer by layer. After each layer is cured, use the triple frequency Nd:YAG laser outside the machine tool to scan the outer edge of the reserved conductive channel to activate it. In this way, the layer by layer cycle is completed. The forming of the substrate, and then put the substrate into the copper plating solution for electroplating, so that the reserved conductive channel is filled with metallic copper, and finally the processing is completed after post-processing. The method of the invention can realize the integrated printing of the complex three-dimensional circuit in the structural parts, has simple process and no assembly, and has good application prospects in the fields of aerospace and precision electronic appliances.

Description

technical field [0001] The present invention relates to a 3D printing technology, in particular to a 3D-MID technology for interconnecting three-dimensional models, in particular to a method for manufacturing structural and circuit integrated components based on stereolithography technology. Background technique [0002] Three-dimensional model interconnection 3D-MID (abbreviation for Three-dimensional Molded Interconnect Device) technology is to make wires and graphics with electrical functions on the injection-molded plastic shell, so as to integrate the electrical interconnection function of ordinary circuit boards, The function of supporting components and the supporting and protecting functions of the plastic shell are implemented on one device, forming a three-dimensional circuit carrier integrating electromechanical functions, that is, a three-dimensional molded interconnect device. 3D-MID technology can choose a suitable shape according to the design needs, has many ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/105C25D3/38
CPCC25D3/38B22F10/00B22F10/36B22F12/41B22F10/12Y02P10/25
Inventor 沈理达严惠谢德巧梁绘昕田宗军邱明波
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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