Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic parameter storage and call method of semiconductor chip automatic packaging equipment

A technology for encapsulating equipment and parameter storage, which is applied in general control systems, control/regulation systems, and program control in sequence/logic controllers. Convenience, clear status, and improved retrieval speed

Active Publication Date: 2019-01-04
TONGLING FUSHI SANJIA MACHINE
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing automatic packaging equipment for semiconductor chips uses PLC as a parameter storage and calling medium, which has cumbersome operations, heavy workload, low work efficiency, and is prone to errors. Therefore, a fully automatic packaging of semiconductor chips is provided. Automatic parameter storage and call method of equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic parameter storage and call method of semiconductor chip automatic packaging equipment
  • Automatic parameter storage and call method of semiconductor chip automatic packaging equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Such as figure 1 , figure 2 As shown, the present invention includes three major steps, parameter data classification, data information management and operation of man-machine interface software of semiconductor chip automatic packaging equipment.

[0015] Parameter data classification: When operating the parameters of the semiconductor chip automatic packaging equipment, call the parameter storage and call program functions in the system respectively according to the instruction requirements. Since the parameter storage and call are all manually set or selected, so During the system cycle scan period, there is no need to increase the scan time to avoid affecting the normal operation of the system. Specifically: Divide all parameters in the system into functional data blocks according to their functions, each functional data block corresponds to a relatively ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic parameter storage and calling method of a semiconductor chip automatic packaging apparatus. The method includes the following steps of (1) parameter data classification; (2) data information management; (3) initialization operation; (4) parameter input; (5) input parameter determination; (6) variety copy: a number of functional data blocks in a database are divided into sub-function modules secondarily according to the usage function, and after receiving the copy instruction, the system analyzes the received instructions and determines the sub-function module data area needed to be copied to carry out the mutual reading and storage of the data blocks in different varieties. By using the database management parameters, the automatic parameter storage and calling problems of the automatic packaging apparatus are solved, and during the parameter setting and calling, a main program responds to apparatus parameter modification or call instructions, analyzes the stored and called parameter locations, and writes in or call the corresponding parameters from the database.

Description

technical field [0001] The invention relates to the field of full-automatic industrial manufacturing equipment, in particular to an automatic parameter storage and calling method of a semiconductor chip full-automatic packaging equipment. Background technique [0002] my country's semiconductor industry has maintained a rapid development trend. However, domestic packaging companies use manual or semi-automatic packaging based on single-cylinder molds to realize a fully automated production process, which is conducive to improving production efficiency and product quality. This is the development direction of my country's packaging industry. Packaging equipment is the process from semiconductor integrated circuit to packaging production process. Fully automatic packaging equipment realizes the operation of mechanical devices through electrical and intelligent equipment without manual intervention, and completes the whole process from loading, loading to receiving. Automate t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/05
CPCG05B19/054G05B2219/1103
Inventor 汪辉丁宁陈迎志曹玉堂徐善林方唐利丁丽成
Owner TONGLING FUSHI SANJIA MACHINE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com