High-precision two-sided aluminum substrate embedded with super high thermal conductive ceramic block and manufacturing method thereof

Abstract

The invention discloses a high-precision two-sided aluminum substrate embedded with a super high thermal conductive ceramic block and a manufacturing method thereof. A big hole is firstly drilled in a position needing to be conducted, then filling the high thermal conductive ceramic block into the big hole, pressing copper foil on an aluminum substrate in a press fitting manner to form the two-sided aluminum substrate, and at last drilling a small hole in the ceramic block and electroplating a metal conduction layer on the inner wall of the small hole, thus forming the two-sided aluminum substrate capable of being interconnected with the other one. According to the two-sided aluminum substrate provided by the invention, all defects caused by traditional resin filling is thoroughly solved, the heat conductivity coefficient of the aluminum oxide ceramic block is 29.3W / (M.K) which is about 150 times that of epoxy resin, so that heat dissipation function of the aluminum substrate is greatly enhanced; meanwhile interlayer interconnection can also be achieved, the problem that the two-sided aluminum substrates cannot be interconnected is well solved, an application range of the aluminum substrate is greatly expanded, the market future is good, and particularly broad future development is provided in the LED field.

Description

technical field [0001] The invention relates to a double-sided aluminum substrate, in particular to a double-sided aluminum substrate with a high-precision embedded ultra-high thermal conductivity ceramic block and a manufacturing method thereof. Background technique [0002] The appearance of LED has greatly reduced the loss of electric energy. Under the premise of the same brightness, the power consumption of LED will be reduced by 300%. In recent years, due to the reduction of LED cost, LED lamps have gradually replaced tungsten lamps, and the application prospect and market of LED are very impressive. The high heat dissipation performance of the aluminum substrate can solve the heat dissipation problem of the LED lamp very well, so the aluminum substrate has also attracted more and more attention from the market. However, due to the conductivity of aluminum, the performance of interlayer interconnection cannot be realized, so the application of aluminum substrates is al...

AI Technical Summary

Problems solved by technology

However, due to the conductivity of aluminum, the performance of interlayer interconnection cannot be realized, so the application of aluminum substrates is also very limited.

[0003] The existing double-sided aluminum substrates use traditional resin to fill the large holes to achieve interlayer interconnection, but there are many disadvantages: first, traditional resins are prone to bubbles when filling the large holes, and cracks are prone to occur at high temperatures. Secondly, the thermal conductivity of traditional epoxy resin is only 0.2W / (M.K), which cannot meet the heat dissipation requirements of aluminum substrates more and more, and the heat dissipation coefficient of aluminum substrates produced in this way There is a difference between the heat dissipation coefficient and the interlayer heat dissipation coefficient, which cannot meet the quality requirements of the product

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