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Preparation method of surface-mounted LED light source, and surface-mounted LED light source

A technology of LED light source and LED chip, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as the inability to realize flexible patch production, achieve good thermoelectric separation effect, improve heat dissipation rate, improve reliability and stability sexual effect

Inactive Publication Date: 2017-06-27
NINGBO SUNPU OPTO SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a method for preparing a chip-type LED light source and a chip-type LED light source, so as to solve the current situation that flexible chip production cannot be realized due to the limitation of the bottom polarity of the chip LED light source

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  • Preparation method of surface-mounted LED light source, and surface-mounted LED light source
  • Preparation method of surface-mounted LED light source, and surface-mounted LED light source
  • Preparation method of surface-mounted LED light source, and surface-mounted LED light source

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Embodiment Construction

[0039] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] The terms "first", "second", "third" and "fourth" in the specification and claims of this application and the above drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device compris...

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Abstract

The embodiment of the invention discloses a patch type LED light source, which includes a plurality of LED chips and a first substrate. The first surface of the first substrate is used to arrange the LED chips fixed by welding material, and to solder each LED chip; the positive and negative electrodes are arranged on the first surface of the substrate as electrodes of the SMD LED light source. The production flexibility of the patch-type LED light source is improved; in addition, the electrodes are arranged on the first surface of the first substrate, which has a good thermoelectric separation effect and improves the heat dissipation rate of the entire patch-type LED light source, thereby helping to improve The reliability of the LED light source; and it can also avoid the design of the traditional thermoelectric separation substrate, which reduces the production cost of the LED light source and the user's use cost. In addition, the embodiment of the present invention also provides a corresponding preparation method, and the preparation method has corresponding advantages.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of light source manufacturing, in particular to a method for preparing a chip-type LED light source and a chip-type LED light source. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device capable of converting electrical energy into visible light. One end of the semiconductor chip is attached to a bracket as the negative pole, and the other end is connected to the positive pole of the power supply. The whole chip is encapsulated by epoxy resin to protect the inner core wire, so that it has better shock resistance. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and inside it, hole occupies an leading position, and the other end is N-type semiconductor, mainly electron, and the two form P-N junction. When the current acts on the chip through the wire, the electrons will flow to the P regi...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/64H01L25/075
CPCH01L33/486H01L25/0753H01L33/62H01L33/647H01L2933/0033H01L2933/0066H01L2933/0075
Inventor 杜元宝张耀华蔡晓宁林胜张日光
Owner NINGBO SUNPU OPTO SEMICON