Cooling module
A heat dissipation module and heat source technology, applied in cooling/ventilation/heating transformation, modification through conduction heat transfer, electrical components, etc., can solve the problem of limited number of power supply interfaces, inoperable main board, and inability of power supply module to supply power to the central processing unit And other issues
Active Publication Date: 2019-06-11
GIGA BYTE TECH CO LTD
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Problems solved by technology
[0003] However, the cooling fluid is mainly used to dissipate heat for specific electronic components. For example, if the cooling component with cooling fluid inside is installed above the central processing unit, the cooling component will only dissipate heat to the central processing unit, and it will have a cooling effect on the electronic components around the cooling component. quite limited
However, on a general motherboard, a power supply module is usually placed next to the central processing unit to supply power to the central processing unit. The module may be overheated, resulting in a crash or component burnout, which makes the power supply module unable to supply power to the central processing unit, thereby causing the motherboard to fail to operate
In addition, the number of power supply ports on the motherboard is limited. If the cooling components need to be plugged in, power distribution needs to be considered
Method used
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[0045] figure 1 It is a schematic diagram of a cooling module configured on a motherboard according to an embodiment of the present invention. figure 2 yes figure 1 A top view of the cooling assembly of the thermal module. see figure 1 and figure 2 , the heat dissipation module 100 of this embodiment is suitable to be configured on the motherboard 10 . exist figure 1 Among them, the motherboard 10 includes a main heat source 12 and a plurality of secondary heat sources 14 adjacent to the main heat source 12 . The main heat source 12 is, for example, a central processing unit, and the secondary heat source 14 is, for example, a power supply module for supplying power to the central processing unit. Of course, the types, positions, and quantities of the main heat source 12 and the auxiliary heat source 14 are not limited to the above.
[0046] In this embodiment, the heat dissipation module 100 includes a cooling component 110 , a pipeline component 120 , a first fan 13...
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The invention discloses a heat dissipation module which is suitable for being configured on a heat source. The heat dissipation module comprises a cooling assembly, a pipeline assembly, a first fin group, a first fan, a second fan, a first magnetic member and a second magnetic member. The cooling assembly comprises a heat conduction member, a flow channel and a pump, the heat conduction member is suitable for being configured on the heat source and is thermally coupled to the flow channel, and at least a part of the pump is arranged in the flow channel. The pipeline assembly is communicated with the flow channel, and cooling fluid is suitable for flowing in the pipeline assembly and the flow channel. The pipeline assembly traverses the first fin group. The first fan is configured next to the first fin group in order to cool the first fin group. The second fan is configured above the cooling assembly. The first magnetic member is linked to the pump. The second magnetic member is linked to the second fan, and the second fan is driven by the pump by means of magnetic attraction or repulsion between the second magnetic member and the first magnetic member.
Description
technical field [0001] The present invention relates to a cooling module, and in particular to a cooling module with double fans. Background technique [0002] Electronic components, such as a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor (MCU) or a metal oxide semiconductor field effect transistor (MOSFET), etc., generate a lot of heat during operation. With the advancement of technology, the power of these electronic components is higher, and more heat will be generated during operation. It is necessary to use heat dissipation components to remove the heat generated by the electronic components, so that the electronic components can be maintained at an appropriate operating temperature to avoid crashes or It is the situation where the component is burned. Generally speaking, electronic components use fans and fins to dissipate heat. When the cooling method of the fan cannot effectively reduce the temperature of the electronic component...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20145H05K7/20254H05K7/20272H05K7/2039
Inventor 简源利郑为元张燕雲
Owner GIGA BYTE TECH CO LTD