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Transfer substrate and manufacturing method thereof, OLED device manufacturing method

A transfer printing substrate and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of organic thin film layer damage, lower OLED performance, reduce OLED life, etc., to improve performance and life , the effect of avoiding serious injury

Active Publication Date: 2020-05-26
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that when the existing sputtering process produces a transparent cathode, it will cause serious damage to the organic thin film layer, reduce the performance of the OLED, and reduce the life of the OLED, the embodiment of the present invention provides a transfer substrate and its manufacturing method, OLED device Production Method

Method used

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  • Transfer substrate and manufacturing method thereof, OLED device manufacturing method
  • Transfer substrate and manufacturing method thereof, OLED device manufacturing method
  • Transfer substrate and manufacturing method thereof, OLED device manufacturing method

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Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0040] figure 1 It is a structural schematic diagram of a transfer substrate provided by an embodiment of the present invention. The transfer substrate is used for electrode thermal transfer printing of OLED devices. The transfer substrate includes a light-transmitting substrate 10 and a light-to-heat conversion layer 11; the light-to-heat conversion layer 11 includes A plurality of protrusions 101 arranged in an array, the protrusions 101 include a bottom surface and a top surface arranged in parallel, the bottom surface is arranged on the light-transmitting substrate 10 , and the top surface of each protrusion 101 is used for setting an electrode block to be transferred.

[0041] When the transfer substrate provided by the present in...

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Abstract

The invention discloses a transfer substrate, a manufacturing method thereof, and an OLED device manufacturing method, belonging to the field of displays. The transfer substrate is used for electrode thermal transfer of OLED devices, and the transfer substrate includes a light-transmitting substrate and a light-to-heat conversion layer; the light-to-heat conversion layer includes a plurality of protrusions arranged in an array, and the protrusions It includes a bottom surface and a top surface arranged in parallel, the bottom surface is arranged on the light-transmitting substrate, and each raised top surface is used for setting an electrode block to be transferred. Using the transfer substrate to realize OLED cathode production avoids the problem of serious damage to OLED organic thin film layers when the existing sputtering process produces a transparent cathode, thereby improving the performance and life of the device.

Description

technical field [0001] The invention relates to the field of displays, in particular to a transfer printing substrate, a manufacturing method thereof, and an OLED device manufacturing method. Background technique [0002] At present, commonly used displays mainly include two categories: Organic Light-Emitting Display (English, Organic Light-Emitting Display, OLED for short) and Liquid Crystal Display (English Liquid Crystal Display, LCD for short). Wherein, the OLED display panel mainly includes a base plate and a cover plate, the OLED light-emitting unit is arranged on the base plate, and the cover plate is covered above the OLED light-emitting unit on the base plate. The OLED light-emitting unit includes an anode, an organic thin film layer and a cathode formed sequentially on a substrate, and the organic thin film layer mainly includes a hole layer, an electron layer and a light-emitting layer between them. [0003] OLED can be divided into three types according to the d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41C1/00H01L51/00H01L51/56
CPCB41C1/00H10K71/18H10K71/00
Inventor 侯文军
Owner BOE TECH GRP CO LTD
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