Efficient silicon wafer printing machine

[0019] Example

[0020] like Figure 1-3 As shown, a high-efficiency silicon wafer printing machine includes a frame 1 and a workbench 2 rotatably arranged on the frame 1. The workbench 2 is provided with a conveyor belt for conveying silicon wafers, and the conveyor belt passes through the frame. The friction wheel on 1 is driven to rotate, and an adjustment plate 4 is installed on the workbench 2. The adjustment plate 4 corresponds to the conveyor belt, and the frame 1 is provided with a cylinder for driving the adjustment plate 4 to rotate. 5. An adjusting nut 6 is threadedly connected to the protruding end of the cylinder 5, and a push rod 3 is rotated on the adjusting nut 6, and the push rod 3 is in contact with the adjusting plate 4.

[0021] The push rod 3 is provided with a roller 7 , and the roller 7 is in contact with the regulating plate 4 .

[0022] The roller 7 is provided with a sliding sleeve 8 , the sliding sleeve 8 is sleeved on the push rod 3 , and a first spring 9 is provided between the sliding sleeve 8 and the push rod 3 .

[0023] A guide shaft 10 is provided on the protruding end of the cylinder 5 , and the push rod 3 is slidably disposed on the guide shaft 10 .

[0024] The adjusting nut 6 is provided with a knurling 601 .

[0025] The workbench 2 is provided with a chute 201, a buffer block 11 is slidably arranged in the chute 201, a second spring 12 is arranged between the chute 201 block and the chute 201, and the buffer block 11 is in contact with the regulating plate 4 .

[0026] Protruding points 13 are provided on the contact surface between the buffer block 11 and the adjusting plate 4, and the material of the protruding points 13 is rubber.

[0027] When the above-mentioned high-efficiency silicon wafer printing machine is adjusted, the specific operation steps are as follows: firstly control the adjustment nut 6, the adjustment nut 6 rotates on the ejector rod 3, and drives the ejector rod 3 to move on the extension end of the cylinder 5, and the ejector rod 3 guides Displacement on the shaft 10 can be done by adjusting the distance between the roller 7 on the push rod 3 and the adjustment plate 4 as required, and the adjustment of the distance between the roller 7 and the adjustment plate 4 is completed. When in use, start the cylinder 5, the extended end of the cylinder 5 drives the push rod 3 to rise, and the push rod 3 drives the roller 7 at the same time, and makes the roller 7 approach the adjustment plate 4; when the roller 7 contacts the adjustment plate 4, the roller 7 goes up The first spring 9 between the sliding sleeve 8 and the push rod 3 is squeezed, eliminating the impact force between the roller 7 and the adjustment plate 4, and the roller 7 lifts the adjustment plate 4, so that the adjustment plate 4 is on the workbench 2 Rotate upwards, so that the silicon wafer follows the rotation and tilts to one side for positioning. After the positioning of the silicon wafer is completed, the cylinder 5 is controlled to shrink. Plate 4 can be restored to its original state. When the cylinder 5 fails, the adjustment plate 4 rotates quickly and returns to its original shape. At the same time, the adjustment plate 4 is in contact with the buffer block 11. On the one hand, the bump 13 is used for buffering and damping between the adjustment plate 4 and the buffer block 11, and then the working table 2 The second spring 12 in the upper chute 201 buffers and damps the adjustment plate 4 to prevent the collision between the adjustment plate 4 and the workbench 2. There are several buffer blocks 11 evenly along the circumference.