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Binding effect detection device for AMOLED (Active Matrix/Organic Light Emitting Diode) product and detection method

A detection device and product technology, applied in the direction of measuring device, measuring electricity, measuring electrical variables, etc., can solve the problems of difficulty in human eye inspection and identification, human eye fatigue, subjectivity, and high false detection rate, so as to improve the level of production automation, The effect of improving product reliability requirements and high accuracy

Pending Publication Date: 2017-07-07
LEAD COMM
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, tiny MARK points are generally set on the IC chip and the AMOLED glass plate, and the binding effect of the IC chip and the AMOLED glass plate is judged by checking whether the MARK points of the two are completely aligned with human eyes. Small, it is very difficult to check and identify with human eyes, and human eyes are prone to fatigue and subjectivity. For this kind of high-precision alignment judgment, not only the false detection rate is high but the efficiency is very low

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  • Binding effect detection device for AMOLED (Active Matrix/Organic Light Emitting Diode) product and detection method
  • Binding effect detection device for AMOLED (Active Matrix/Organic Light Emitting Diode) product and detection method
  • Binding effect detection device for AMOLED (Active Matrix/Organic Light Emitting Diode) product and detection method

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Embodiment Construction

[0029] The binding effect detection device proposed by the present invention, the principle of AMOLED binding impedance detection is to design impedance test points at both ends of the binding area on the AMOLED glass plate, lead the line to the FPC circuit board through the IC terminal, and finally measure through the precision resistance The instrument detects the voltage of two sets of test points to determine the binding effect. Specifically, as figure 1 As shown, the AMOLED product includes an AMOLED glass plate, an IC chip and an FPC circuit board 3, the IC chip is pre-pressed and bound on the AMOLED glass plate, the conductive end of the FPC circuit board 3 is bound on the AMOLED glass plate, and the FPC circuit board 3 The test end is located outside the AMOLED glass plate, and the test end is provided with two sets of COG test points electrically connected to the IC chip. Such as figure 2 As shown, the test end also has two sets of FOG test points electrically conn...

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Abstract

The invention discloses a binding effect detection device for an AMOLED (Active Matrix / Organic Light Emitting Diode) product and a detection method, wherein the AMOLED product includes an AMOLED glass plate, an IC chip and an FPC (flexible printed circuit) board, wherein the FPC board is provided with two sets of COG (Chip On Glass) test points electrically connected with the IC chip. The binding effect detection device includes a base, a rotating probe and a display; the rotating probe is provided with two sets of COG impedance probes; the arrangement positions of the two sets of COG impedance probes are the same as the arrangement positions of the two sets of COG test points; and the rotating probe can rotate to a position above the FPC board, and the two sets of COG impedance probes contact with the two sets of COG test points. The present invention also provides a detection method of the above binding effect detection device. According to the binding effect detection device and the detection method of the invention, a binding effect is judged through detecting binding impedance, and therefore, detection efficiency and automation level can be improved.

Description

technical field [0001] The invention relates to the technical field of AMOLED product production detection, in particular to a binding effect detection device and detection method for AMOLED products. Background technique [0002] The Chinese full name of AMOLED is active matrix organic light-emitting diode or active matrix organic light-emitting diode. COG (Chip On Glass) refers to the use of an adhesive film (anisotropic conductive film ACF) containing metal particles. Through Pre-pressing binds the IC chip on the AMOLED glass plate, so that the circuit between the IC and the LCD glass plate is connected. Due to the small area of ​​the IC chip, the number of single I / O terminals is large. In order to have a good connection between the IC and the AMOLED glass plate, very precise positioning of the IC and the AMOLED is required. [0003] In the prior art, tiny MARK points are generally set on the IC chip and the AMOLED glass plate, and the binding effect of the IC chip and...

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Application Information

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IPC IPC(8): G01R27/02G01R31/04
CPCG01R27/02G01R31/68
Inventor 李幸元胡铁柱
Owner LEAD COMM