Packaging structure of image sensor

Abstract

The invention discloses a packaging structure of an image sensor. A light-absorbing layer is covered on an inner sidewall. Meanwhile, a cofferdam higher than 100 mum is adopted instead of a relatively low photoresist polymer cofferdam, so that the distance between contamination particles on the surface of a light-transmitting cover plate and a photosensitive region is increased. The affected area of the light blocked by the particles in the photosensitive region is reduced, and the incidence angle of the incident light is also reduced. The light-absorbing layer is covered on the inner sidewall of the cofferdam, so that the reflection of the obliquely incident light or the reflected light in the photosensitive region on the inner sidewall of the cofferdam is effectively inhibited. The interference light shooting into the photosensitive region is reduced, and the imaging quality is improved.

Description

technical field [0001] The invention relates to wafer-level packaging of semiconductor chips, in particular to an image sensor packaging structure. Background technique [0002] The current mainstream of the wafer-level packaging solution for image sensors is to bond the ordinary glass cover and its photoresist polymer cofferdams below 70 μm on the surface to the functional surface of the wafer of the image sensor. Each cofferdam corresponds to each image. The sensor chip makes the position of the photosensitive area form a sealed cavity. Perform TSV process on the non-functional surface of the wafer, and make metal lines to lead the pads on the functional surface to the non-functional surface of the wafer through the TSV opening. After making bumps on the non-functional surface, it is cut to form a single chip. [0003] However, the current packaging solutions are mainly aimed at image sensors with low and medium pixels. With the improvement of pixels and shooting quality...

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Problems solved by technology

[0003] However, the current packaging solutions are mainly aimed at image sensors with low and medium pixels. With the improvement of pixels and shooting quality requirements, the impact of the above-mentioned packaging solutions on the light incident on the photosensitive area must be minimized by the external pollution of the glass. The reflection on the structural parts also needs to be strictly controlled. The interference of glare, ghosting and other phenomena on the shooting quality cannot be ignored

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