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Substrate cutting device and substrate cutting method

A cutting device and cutting method technology, applied in glass cutting devices, manufacturing tools, glass manufacturing equipment and other directions, can solve the problems of glass cutting device damage, substrate exposure, and the substrate is not easy to be cut, so as to improve the cutting force, shorten the time, The effect of preventing damage

Active Publication Date: 2021-11-16
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Usually, the cut substrate is not easily cut during the breaking process of the substrate cutting process, or a part of the uncut uncut substrate is exposed, causing damage to the glass cutting device

Method used

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  • Substrate cutting device and substrate cutting method
  • Substrate cutting device and substrate cutting method
  • Substrate cutting device and substrate cutting method

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Embodiment Construction

[0034] The present invention can be variously modified and can have various embodiments, and specific embodiments are shown in the drawings and described in detail in the specification. The technical effects, features and methods for achieving the object of the present invention can be clearly understood by referring to the embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various forms.

[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the description with reference to the drawings, the same reference numerals are assigned to the same or corresponding constituent elements, and repeated description thereof will be omitted.

[0036] In the following embodiments, terms such as first and second are not intended to be limiting, but are used to distinguish one constituent element ...

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Abstract

The invention discloses a substrate cutting device and a substrate cutting method. A substrate cutting device according to an embodiment of the present invention may include: a scribing device having a scribing wheel arranged to face one surface of the substrate; a first breaking device having a breaking roller arranged To face the other surface of the substrate; the second breaking device has a gas injection device arranged to face one side of the substrate.

Description

technical field [0001] Embodiments of the present invention relate to a substrate cutting device and a substrate cutting method. Background technique [0002] Centering on mobile devices such as smartphones that require slim thickness, glass materials such as tempered glass are increasingly used as materials for display windows. However, the processability of such a glass material is relatively weak, so it is processed using glass scribing equipment, laser equipment, water jet equipment, and the like. [0003] Among them, the scribing method is widely used in glass cutting because of its low processing cost and high cutting speed. A glass cutting process using scribing is classified into a scribing process in which grooves are formed on the surface of glass and a breaking process in which cutting is performed by applying stress to the glass. [0004] The scribing process is a process of forming grooves on one side surface of glass using a diamond scriber. The fracture pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/033
CPCC03B33/033Y02P40/57
Inventor 李权日
Owner SAMSUNG DISPLAY CO LTD
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