Sampling measurement system and sampling measurement method

A technology for measuring and measuring data, applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as waste of resources, improve manufacturing yield, reduce process risks, and reduce The effect of product scrap rate

Active Publication Date: 2017-07-14
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the sampling measurement system in the prior art often has adjustment hysteresis, resulting in waste of resources

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sampling measurement system and sampling measurement method
  • Sampling measurement system and sampling measurement method
  • Sampling measurement system and sampling measurement method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] It can be known from the background technology that the sampling measurement system in the prior art has the problem of adjustment lag. Now combine the sampling method of the sampling measurement system in the prior art to analyze the reasons for the adjustment lag:

[0017] reference figure 1 , Shows a fragmentary flow chart of the semiconductor device production process in the prior art.

[0018] In the prior art, the wafer sequentially executes each process according to a preset process flow. The process step S10 and the process step S20 are any two adjacent semiconductor process steps that are connected back and forth. After the process step S10 and before the process step S20, perform the measurement step Sm to measure the work in process to determine whether the work in process after the process step S10 is qualified or not, and the measured work in progress enters the subsequent process step S20 for production .

[0019] In the measurement step Sm, the measurement ef...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a sampling measurement system and a sampling measurement method. By setting a first measurement scheme and a second measurement scheme in advance, the sampling rate of the first measurement scheme is larger than the sampling rate of the second measurement scheme, the first measurement scheme with relatively large sampling rate is employed when a batch product in production is judged to be a high-risk batch product in production and the measurement yield is judged to be enough, the process expression can be timely understood, the scrap rate of the product is reduced, and the manufacturing yield is improved; and the second measurement scheme with relatively small sampling rate is employed when the batch product in production is judged not to be the high-risk batch product in production or the measurement yield is judged not to be enough, so that the production period of the product is shortened. Therefore, the process risk estimation can be performed on the batch product in production based on the measurement information of the batch product in production, the measurement schemes with different sampling rates are selected to be employed according to the process risk level of the batch product in production, and the requirements that the production period of the product is shortened and the process expression is timely fed back can be compatible.

Description

Technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a sampling measurement system and a sampling measurement method thereof. Background technique [0002] With the reduction in device size, the complexity of the semiconductor integrated circuit manufacturing process continues to increase, and the pressure of industrial competition makes the time for products to market more and more important. Therefore, the control of the production cycle (Cycle Time) and production cost of semiconductor integrated circuit products is very important for the foundry (FAB). Therefore, the use of scientific and effective process control methods to help quickly detect and improve abnormal process performance is very valuable for foundries. [0003] In the manufacturing process of semiconductor integrated circuits, there are many types of processes in the process flow, including manufacturing processes and measurement processes. The purpose of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66
Inventor 陈彧
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap