An adaptive vertical routing method and routing unit based on a network on chip

Abstract

The invention discloses an adaptive vertical routing method based on an on-chip network and a routing unit. The routing method includes when transmitting data from a source node to a destination node, each time according to the coordinate position of the current node of the transmitted data and the coordinate position of the destination node. The relationship determines the direction of the next transmission node, so that when the source node is in the upper position of the destination node, it will be transmitted in the vertical direction first and then in the horizontal direction, and when the source node is in the lower position of the destination node, it will be transmitted in the horizontal direction first Then transmit in the vertical direction, and directly transmit in the horizontal direction when the source node and the destination node are at the same layer; the routing unit includes an input-output interface unit, an input-output selection unit and a direction calculation unit. The invention can realize self-adaptive vertical routing based on the on-chip network, and has the advantages of simple realization method, less transmission time, avoidance of transmission congestion, temperature control, flexible transmission and the like.

Description

Technical field [0001] The invention relates to the technical field of microprocessor-on-chip network transmission, in particular to an adaptive vertical routing method and routing unit based on the on-chip network. Background technique [0002] With the development of modern technology, the structure of the on-chip network has gradually become a popular structure for VLSI design, but this structure increases performance while also causing a large number of temperature problems, including the reduction of global interconnect lines in order to improve transmission efficiency The length of the core and the greater bandwidth with lower power consumption, the shortening of interconnection lines and the increase in traffic speed up the heat generation; at the same time, due to area and timing constraints, the arrangement of many cores has become more Tight, block stacking makes heat dissipation more difficult. At the same time, the 3D-NoC structure makes the heat dissipation paths of ...

AI Technical Summary

Problems solved by technology

[0005] At present, in network-on-chip transmission, it is usually used to fix all the transmissions on the bottom layer before reaching congestion. Vertical transmission leads to increased delay. For example, when both the source node and the destination node are at the top layer, if the above routing method is used to route downwards, a large number of redundant vertical transmissions will be added, which will greatly increase the length of the transmission path, which not only increases the delay but also increases the delay. Increased the burden on the bottom; if the source node is on the lower layer and the destination node is on the top layer, if the above routing method is used to transmit vertically and then horizontally, the transmission will appear on the top layer, which will make the heat dissipation path of the top layer long and cause the problem of overheating

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