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Substrate handling apparatus with lift pin assembly

A technology of substrate processing device and pin assembly, which is applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., and can solve the problem of enlarged stain area on the pin part on the substrate surface, etc.

Active Publication Date: 2019-12-10
DMS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to prevent this friction phenomenon, if the diameter of the lift pin groove is increased, there will be a difference in the amount of heat transfer around the lift pin groove, and there will be a problem that the pin portion stain area on the substrate surface will increase.

Method used

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  • Substrate handling apparatus with lift pin assembly
  • Substrate handling apparatus with lift pin assembly
  • Substrate handling apparatus with lift pin assembly

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Embodiment Construction

[0020] Hereinafter, referring to the above-mentioned problems to be solved, it may be explained with reference to the accompanying drawings of preferred embodiments of the present invention embodied in the present invention. Based on the description of the present embodiment, the same names and the same symbols are used for the same structures, and additional explanations thereof will be omitted below.

[0021] refer to figure 1 with figure 2 , a description of an embodiment of a substrate processing apparatus according to the present invention is as follows.

[0022] The substrate processing apparatus includes a chamber body 100 , a heater unit 200 , a lift pin assembly 300 and a main unit 400 .

[0023] An inner space is formed in the chamber main body 100 for accommodating the substrate 10 to be processed and the heater unit 200 . Specifically, the chamber body 100 includes: an upper frame 110 forming an upper wall based on the inner space, and a lower frame 120 combini...

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Abstract

The invention provides a substrate processing apparatus including a lift pin assembly. The device is characterized in that the device includes a cavity main body forming an internal space for housing and processing a substrate, a heater unit which is configured in the internal space of the cavity main body and the upper side is provided with the substrate and a first lift pin slot part, a lift pin assembly having a lift pin unit which enables the substrate to move up and down while the heater unit which runs through upwards and downwards, when thermal deformation of the heater unit occurs, an upper part region being moved towards a horizontal direction according to the position of the first lift pin slot part, wherein the lift pin unit includes a top lift pin inserted into in the first lift pin slot part, a middle lift pin which can move relative to the top lift pin, a first connecting component connecting the upper lift pin with the middle lift pin, a lower lift pin which can move relative to the middle lift pin, and a second connecting component connecting the middle lift pin with the lower lift pin.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a device which minimizes the size of a lift pin groove portion formed on a heater unit and also minimizes cracking between the lift pin and the heater unit. Substrate handling apparatus for lift pin assemblies. Background technique [0002] In general, in devices such as semiconductor manufacturing equipment and flat panel display device manufacturing equipment, lift pins are used to load or unload semiconductor wafers, glass substrates, etc. on or off a mounting table. [0003] In addition, in order to manufacture a semiconductor element or a liquid crystal display element, it is necessary to repeat several times the thin film deposition process of depositing a thin film of a dielectric material etc. on a wafer or glass (hereinafter referred to as a substrate), and to use a photosensitive material to expose or hide a selected part of the thin film. The etchin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67G02F1/13
CPCG02F1/1303H01L21/67011H01L21/67103H01L2221/67H01L2221/683
Inventor 朴庸硕朴镐胤具滋贤
Owner DMS CO LTD
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