How to make pcb and pcb

Abstract

The invention provides a PCB making method and a PCB. The PCB making method comprises the following steps: a plurality of core boards are provided for preparing a PCB by lamination, and blind holes are arranged in the PCB, wherein blind hole target PADs are arranged on the surfaces of the core boards corresponding to the bottom surface of the blind holes, and X-ray alignment targets are arranged at the edges of the core boards; (2) the core boards are laminated into a laminated board; (3) an X-ray target drill is provided, X-ray scanning is carried out, the X-ray alignment target corresponding to each position on the laminated board is captured, the center point of the X-ray alignment target at each position is calculated, and target holes are arranged by drilling; (4) a CCD drill is provided, the CCD drill captures the target holes for alignment, the drilling positions of the blind hole target PADs of the corresponding core boards on the surface of the laminated board are determined in an automatic adjustment compensation way, and blind holes are arranged by drilling; and (5) a laser drill is provided, residue left after blind hole drilling by the CCD drill is burnt to expose the blind hole target PADs, and deep micro blind holes are obtained. Through the PCB making method of the invention, high-order deep micro blind holes can be machined quickly and accurately.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board (PCB), in particular to a method for processing high-order deep micro-blind holes in a PCB and the processed PCB. Background technique [0002] The development and application of blind hole technology has greatly promoted the development of high-density integrated circuit technology and microelectronics technology, making electronic products lighter, thinner and smaller, with highly dense functions and stronger performance. PCB It is usually formed by lamination of multi-layer core boards. It is especially common to set up high-order blind holes on the PCB. Usually, the industry's name for several-order blind holes corresponds to the number of core board layers that blind holes penetrate. For example, blind holes are only opened on the outside. The first-layer core board is a first-order blind hole, and the first-layer and adjacent second-layer core board is a second-order blin...

AI Technical Summary

Problems solved by technology

The multilayer board at the bottom of this kind of high-order blind hole has low depth control accuracy when opening blind holes mechanically, and it is difficult to reach the specified layer. It has high requirements for the thickness of the dielectric layer of the adjacent layer, and it will damage the thickness of the dielectric layer. Hidden dangers (high pressure test, etc.), and the smaller the aperture, the greater the production cost and difficulty

Images