Silicon wafer pre-alignment mechanism, exposure device and exposure method

Abstract

The invention discloses a silicon wafer pre-alignment mechanism, an exposure device and an exposure method. The silicon wafer pre-alignment mechanism is arranged at a silicon wafer edge of the silicon wafer pre-alignment mechanism by scanning, is used for pre-aligning a silicon wafer and comprises more than three image sensors and reference marks, wherein the image sensors are used for performing pre-alignment operation, the reference marks are arranged on a workpiece bench and are corresponding to the image sensors, and the image sensors are used for acquiring position information of the workpiece bench by acquiring position information of the reference marks. According to the technical scheme provided by the invention, more than three reference marks are arranged on the workpiece bench, the image sensors corresponding to the reference marks acquire the position information of the reference marks after a station of the workpiece bench is switched so as to acquire a switching error of the workpiece bench, and the position deviation of a next silicon wafer is compensated according to the switching error.

Description

technical field [0001] The invention relates to a silicon chip pre-alignment mechanism, an exposure device and an exposure method, which are applied in the field of integrated circuit production. Background technique [0002] In the production process of integrated circuits, the exposure device of the lithography machine mainly adopts two exposure methods of stepping or stepping and scanning. With the improvement of the resolution and production efficiency requirements of the lithography machine, the method of double material carrier is usually used. , to reduce the material handover time and increase the output of the lithography machine, that is, one exposure device includes two workpiece tables, one is the workpiece table for the measurement position, and the other is the workpiece table for the exposure position. Through the loading and unloading of the handover position, two The workpiece table works alternately. Therefore, while ensuring the productivity, a high repea...

AI Technical Summary

Problems solved by technology

The existing technology also proposes a method of adding a third set of measuring sensors on the working path of the double workpiece table. This method specifies the moving track of the workpiece table and sets the grating ruler structure on the entire moving track of the workpiece table. , to measure the workpiece table in the whole process, and to perform feedback control on the workpiece table during the position switching process of the workpiece table. This method has a complex structure, high cost, and is greatly affected by environmental factors.

The above two technologies only control the motion accuracy of the double-workpiece switching process, and do not compensate for the positional deviation of the silicon wafer.

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