IMD glue water with good formability for automobile bumper support plate
A car bumper and formability technology, applied in the IMD field, can solve problems such as difficulty in direct application and adverse effects of subsequent ink processes, and achieve the effects of expanding the scope of application and application potential, high adhesion, and easy operation
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Embodiment 1
[0020] The formula of IMD glue by weight is: 20 parts of epoxy modified acrylic resin (E44), 32 parts of carboxy-type vinyl acetate resin (Taiwan V-38), 10 parts of trimethylbenzene, 5 parts of tetramethylbenzene, 15 parts of cyclohexanone, 3 parts of dibasic acid ester, 3 parts of silicon dioxide, 12 parts of isophorone.
[0021] The preparation method is: mix epoxy-modified acrylic resin, carboxyl-type vinyl acetate resin, trimethylbenzene, tetramethylbenzene and cyclohexanone at 60-70°C, stir and dissolve, and continue to add dibasic acid ester and silicon dioxide after cooling and isophorone and fully stirred to mix evenly, that is.
Embodiment 2
[0023] The formula of IMD glue by weight is: 22 parts of epoxy-modified acrylic resin (E44), 30 parts of carboxy-type vinyl acetate resin (Taiwan V-38), 9 parts of trimethylbenzene, 5 parts of tetramethylbenzene, 16 parts of cyclohexanone, 2 parts of dibasic acid ester, 3 parts of silicon dioxide, 13 parts of isophorone. The preparation method is the same as in Example 1.
Embodiment 3
[0025] The formula of IMD glue by weight is: 18 parts of epoxy modified acrylic resin (FB9801), 34 parts of carboxy-type vinyl acetate resin (Shin-Etsu SOLBIN-M5), 10 parts of trimethylbenzene, 5 parts of tetramethylbenzene, 15 parts of cyclohexanone, 3 parts of dibasic acid ester, 3 parts of silicon dioxide, 12 parts of isophorone. The preparation method is the same as in Example 1.
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