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Gimbal component testing system and method

A component testing and gimbal technology, which is applied in the testing of mechanical components, testing of single semiconductor devices, testing of machine/structural components, etc., and can solve problems such as gimbal bearings affecting test results

Inactive Publication Date: 2019-11-19
MARVELL ASIA PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Variability between individual gimbal bearings can affect test results

Method used

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  • Gimbal component testing system and method
  • Gimbal component testing system and method
  • Gimbal component testing system and method

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Embodiment Construction

[0057] Embodiments of the present invention may provide for testing gimbals, for example, by determining the ability of a gimbal assembly's gimbal bearing (also known as a "spherical bearing") and components mechanically coupled thereto to move based on an applied force Systems and methods for bearing assemblies. A gimbal bearing refers to a ball-and-socket type arrangement for a component in which the component can pivot about two axes and move relative thereto, providing a predefined range three-dimensional movement. Embodiments of the present invention may calculate the correlation between the force applied to the wafer probe card and the resulting planarity of the wafer probe card. The term "force" as used herein may substitute torque, pressure and / or other mechanical inputs based on the intended use of the wafer probe card and / or applicable embodiments. A test system in one embodiment of the present invention may include a protective cover attached to a test surface of ...

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Abstract

The present invention relates to a gimbal component testing system and method, and its aspects provide a gimbal component testing system, including: a protective cover attached to a wafer probe card installed in the gimbal bearing for testing a surface, wherein the protective cover includes an outer surface oriented outwardly from the test surface of the wafer probe card; and a groove extending into the outer surface of the protective cover and shaped to matingly engage a load therein unit end.

Description

technical field [0001] The inventive subject matter disclosed herein relates to gimbal assembly testing systems and methods. More specifically, aspects of the invention relate to systems and methods for determining various attributes of a wafer probe card within a gimbal assembly system, including, for example, the gimbal capability of the probe. Background technique [0002] In the flip-chip process of semiconductor integrated circuit (IC) chips, interconnection structures such as solder bumps are used to connect the IC chips and packages. To determine the field feasibility of an IC chip, a probe card comprising an array of individual probes may contact each of the solder bumps to establish an electrical connection, thereby testing the circuitry within the wafer prior to dicing and packaging the wafer. In order to adapt to the change of the planarity between the probe card and the wafer, the probe card can be installed in the gimbal bearing, and the gimbal bearing allows s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M13/00
CPCG01M13/00G01R1/0735G01R1/07364G01R31/24G01R31/2635G01R31/44G01R33/0017G01R35/005
Inventor D·L·加德尔D·M·奥德特P·W·内夫
Owner MARVELL ASIA PTE LTD