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Anisotropic conductive film, method for producing same, and bonded structure

An anisotropic, conductive film technology, used in conductive connection, electrical component connection, printed circuit manufacturing, etc., can solve problems such as poor conduction and short circuit, and achieve short-circuit suppression, excellent economy, and good initial conductivity. Effect

Active Publication Date: 2019-07-09
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the case of Patent Document 1, there is a problem that it is difficult to densely fill the entire surface of the stretchable film with conductive particles in a single layer without defects, and the conductive particles are filled in the stretchable film in an aggregated state, causing a short circuit. or there is an unfilled area (so-called "missing"), which becomes the cause of poor conduction

Method used

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  • Anisotropic conductive film, method for producing same, and bonded structure
  • Anisotropic conductive film, method for producing same, and bonded structure
  • Anisotropic conductive film, method for producing same, and bonded structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1A

[0365] A nickel plate with a thickness of 2 mm was prepared, and columnar recesses (inner diameter: 5 μm, depth: 6 μm) were formed in a square grid pattern to prepare a transfer master. The distance between the centers of adjacent recesses is 8 μm. Therefore, the density of the recesses is 16000 / mm 2 .

[0366] For the obtained transfer body original disc, 60 mass parts of phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), 29 mass parts of acrylate resin (M208, Toagosei Co., Ltd.), photopolymerized Initiator (IRGACURE 184, BASF Japan Co., Ltd.) 2 parts by mass of the photopolymerizable resin composition is coated on a PET (polyethylene terephthalate) film in a dry thickness of 30 μm, and heated at 80° C. After drying for 5 minutes, it irradiated with light at 1000 mJ using a high-pressure mercury lamp to prepare a transferred body.

[0367] The transfer body was peeled off from the original disk, wound up on a stainless steel roll with a diameter of 20 cm so ...

Embodiment 2A

[0372] Example 1A was repeated except that the spraying amount of the electroconductive particle and the number of times of air blowing were each doubled in Example 1A, and the anisotropic conductive film was obtained.

Embodiment 3A

[0374] Set the inner diameter of the concave part of the transfer body original disk to 3.6 μm, set the distance between the centers of adjacent concave parts to 6 μm, and set the concave part density to 28000 / mm 2 , and using conductive particles with an average particle diameter of 3 μm (AUL703, Sekisui Chemical Industry Co., Ltd.) instead of conductive particles with an average particle diameter of 4 μm, Example 1A was repeated to obtain an anisotropic conductive film.

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Abstract

The present invention provides an anisotropic conductive film having a structure in which conductive particles are arranged at lattice points of a planar lattice pattern on an insulating adhesive base layer, and the planar lattice pattern assumed in the reference region The ratio of grid points without conductive particles to all grid points is less than 20%, and the ratio of grid points arranged by agglomeration of multiple conductive particles to all grid points in a planar grid pattern is less than 15%. The total is less than 25%.

Description

technical field [0001] The present invention relates to anisotropic conductive films. Background technique [0002] It is known that an anisotropic conductive film in which conductive particles are dispersed in an insulating resin binder is widely used when electronic components such as IC chips are mounted on a wiring board, etc., but in such an anisotropic conductive film, the conductive Particles exist in a connected or aggregated state. Therefore, when the anisotropic conductive film is applied to the connection between the terminals of the IC chip and the terminals of the wiring board whose pitch is narrowed along with the weight reduction and miniaturization of electronic equipment, the Conductive particles existing in a connected or aggregated state cause a short circuit between adjacent terminals. [0003] Conventionally, anisotropic conductive films in which conductive particles are regularly arranged in a film have been proposed as an anisotropic conductive film ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01H01R43/00
CPCH01R12/7076H01R13/2414H01L2224/29455H01L24/27H01L24/83H01L2224/29082H01L2224/2919H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/29499H01L2224/32225H01L2224/73204H01L2224/83101H01L2224/83203H01L2224/83862H01L2224/294C08K3/08C08K9/02C09J2203/326C09J7/10H01B1/22H01L24/29H05K3/323H01L2224/27003H01L2224/271H01L2224/27332H01L24/32H01L2224/16227H01L2224/2929H01L2224/2939H01L2224/29386H01L2224/13144C09J2301/208C09J2301/314C09J2301/408H01L2924/00014H01L2224/16225H01L2924/00H01L2924/0665H01L2924/0695H01L2924/05442H01L2924/0635H01L2924/07001H01L2924/05432H01R11/01H01R43/00B32B7/12B32B27/08H01B5/16H01L2924/07802
Inventor 石松朋之塚尾怜司
Owner DEXERIALS CORP