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Method for producing connected body, method for connecting electronic parts, connected body

A technology for electronic components and manufacturing methods, which is applied to printed circuit components, bonding methods for adhesive heating, electrical components, etc. Equalize the problem to achieve the effect of good turn-on reliability

Active Publication Date: 2020-06-09
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the connection method using the thermosetting anisotropic conductive film, the thermal press temperature is high, and the thermal shock to the glass substrate and the flexible substrate becomes large.
In addition, after the anisotropic conductive film is connected, when the temperature drops to normal temperature, the adhesive shrinks due to the temperature difference, and the thinned glass substrate may warp
Therefore, problems such as display unevenness and poor connection of flexible substrates may occur

Method used

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  • Method for producing connected body, method for connecting electronic parts, connected body
  • Method for producing connected body, method for connecting electronic parts, connected body
  • Method for producing connected body, method for connecting electronic parts, connected body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] In Example 1, the photocurable anisotropic conductive film related to formulation A was used. The melt viscosity of the anisotropic conductive film related to the formulation A at the heating temperature (80° C.) in the main crimping process was 1000 Pa·s. The conduction reliability evaluation of the connector sample involved in Example 1 was 5Ω or less (OK), and the extruded width W of the bump was 550 μm (OK). Also, the particle density (a) in the outer edge region was 12.1 pcs / 200×200 μm, and the particle density (b) in the pressing region was 4.2 pcs / 200×200 μm. Furthermore, distortion of the transparent plastic film of the connected body sample was not confirmed.

Embodiment 2

[0110] In Example 2, the photocurable anisotropic conductive film related to the formulation B was used. The melt viscosity of the anisotropic conductive film related to the formulation B at the heating temperature (80° C.) in the main crimping process was 4000 Pa·s. The conduction reliability evaluation of the connector sample involved in Example 2 was below 5Ω (OK), and the extruded width W of the bump was 400 μm (OK). Also, the particle density (a) in the outer edge region was 11.1 pcs / 200×200 μm, and the particle density (b) in the pressing region was 4.5 pcs / 200×200 μm. Furthermore, distortion of the transparent plastic film of the connected body sample was not confirmed.

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Abstract

The present invention secures the bonding strength of electronic components due to the formation of bumps, and prevents staining of a support table, bonding of substrates, and increase in connection resistance of electronic components due to adhesive resins. The method includes an adhesive arrangement step of providing a circuit connection adhesive (6) containing a photopolymerization initiator on a light-transmitting circuit substrate (2), and an adhesive arrangement process via the circuit connection adhesive (6). ) a crimping process of arranging an electronic component (5) on a circuit substrate (2), heating and pressing the electronic component (5) to the circuit substrate (2), and curing the circuit connection adhesive (6), used for circuit connection The melt viscosity of the adhesive (6) at the heating temperature in the crimping step is 4000 Pa·s or less.

Description

technical field [0001] The present invention relates to a method for producing a connected body in which electronic components are connected to a transparent substrate through an adhesive for circuit connection containing a photopolymerization initiator. A connection method for connecting electronic components and a connection body manufactured using the method. [0002] This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2014-212108 for which it applied in Japan on October 16, 2014, and this application is used in this application by reference. Background technique [0003] Conventionally, when connecting rigid substrates such as glass substrates and glass epoxy substrates to electronic components such as flexible substrates and IC chips, adhesive resins in which conductive particles are dispersed as adhesives are used to form films. Anisotropic conductive film. If the connection terminals of the flexible board and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36C09J5/06C09J11/00C09J11/06C09J201/00G06F3/041H05K1/14H05K3/32
CPCC09J5/06C09J11/00C09J11/06C09J201/00G06F3/041H05K1/14H05K3/32H05K3/36H05K1/147H05K3/321H05K3/361
Inventor 浅羽康佑林慎一田中雄介
Owner DEXERIALS CORP