Unlock instant, AI-driven research and patent intelligence for your innovation.

Anisotropic conductive film, manufacturing method for same, and connection structure

An anisotropic, conductive film technology, applied in the direction of conductive connection, electrical component connection, printed circuit manufacturing, etc., can solve problems such as short circuit and poor conduction, and achieve excellent economical efficiency, short circuit suppression, and good conduction reliability. Effect

Active Publication Date: 2017-08-18
DEXERIALS CORP
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the case of Patent Document 1, there is a problem that it is difficult to densely fill the entire surface of the stretchable film with conductive particles in a single layer without defects, and the conductive particles are filled in the stretchable film in an aggregated state, causing a short circuit. or there is an unfilled area (so-called "missing"), which becomes the cause of poor conduction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive film, manufacturing method for same, and connection structure
  • Anisotropic conductive film, manufacturing method for same, and connection structure
  • Anisotropic conductive film, manufacturing method for same, and connection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1A

[0365] A nickel plate with a thickness of 2 mm was prepared, and columnar recesses (inner diameter: 5 μm, depth: 6 μm) were formed in a square grid pattern to prepare a transfer master. The distance between the centers of adjacent recesses is 8 μm. Therefore, the density of the recesses is 16000 / mm 2 .

[0366] For the obtained transfer body original disc, 60 mass parts of phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), 29 mass parts of acrylate resin (M208, Toagosei Co., Ltd.), photopolymerized Initiator (IRGCUR 184, BASF Japan Co., Ltd.) 2 parts by mass of the photopolymerizable resin composition was coated on a PET (polyethylene terephthalate) film in a dry thickness of 30 μm, and heated at 80° C. After drying for 5 minutes, it was irradiated with light at 1000 mJ by a high-pressure mercury lamp to prepare a transferred body.

[0367] The transfer body was peeled off from the original disk, wound up on a stainless steel roll with a diameter of 20 cm so ...

Embodiment 2A

[0372] Example 1A was repeated except that the spraying amount of the electroconductive particle and the number of times of air blowing were each doubled in Example 1A, and the anisotropic conductive film was obtained.

Embodiment 3A

[0374] Set the inner diameter of the concave part of the transfer body original disk to 3.6 μm, set the distance between the centers of adjacent concave parts to 6 μm, and set the concave part density to 28000 / mm 2 , and using conductive particles with an average particle diameter of 3 μm (AUL703, Sekisui Chemical Industry Co., Ltd.) instead of conductive particles with an average particle diameter of 4 μm, Example 1A was repeated to obtain an anisotropic conductive film.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
The average particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

An anisotropic conductive film of the present invention has a structure in which conductive particles are disposed at lattice points of a planar lattice pattern in an insulating adhesive base layer. Assumed for a reference region of the anisotropic conductive film are the following: the ratio of lattice points at which conductive particles are not disposed relative to the total lattice points of the planar lattice pattern is less than 20%; the ratio of the lattice points at which multiple conductive particles are disposed in an aggregated manner relative to the total lattice points of the planar lattice pattern is 15% or less; and the total percentage of these lattice points at which conductive particles are lacking or aggregated is less than 25%.

Description

technical field [0001] The present invention relates to anisotropic conductive films. Background technique [0002] It is known that an anisotropic conductive film in which conductive particles are dispersed in an insulating resin binder is widely used when electronic components such as IC chips are mounted on a wiring board, etc., but in such an anisotropic conductive film, the conductive Particles exist in a connected or aggregated state. Therefore, when the anisotropic conductive film is applied to the connection between the terminals of the IC chip and the terminals of the wiring board whose pitch is narrowed along with the weight reduction and miniaturization of electronic equipment, the Conductive particles existing in a connected or aggregated state cause a short circuit between adjacent terminals. [0003] Conventionally, anisotropic conductive films in which conductive particles are regularly arranged in a film have been proposed as an anisotropic conductive film ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01R11/01H01R43/00
CPCH01R12/7076H01R13/2414H01L2224/29455H01L24/27H01L24/83H01L2224/29082H01L2224/2919H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/29499H01L2224/32225H01L2224/73204H01L2224/83101H01L2224/83203H01L2224/83862H01L2224/294C08K3/08C08K9/02C09J2203/326C09J7/10H01B1/22H01L24/29H05K3/323H01L2224/27003H01L2224/271H01L2224/27332H01L24/32H01L2224/16227H01L2224/2929H01L2224/2939H01L2224/29386H01L2224/13144C09J2301/208C09J2301/314C09J2301/408H01L2924/00014H01L2224/16225H01L2924/00H01L2924/0665H01L2924/0695H01L2924/05442H01L2924/0635H01L2924/07001H01L2924/05432H01R11/01H01R43/00B32B7/12B32B27/08H01B5/16H01L2924/07802
Inventor 石松朋之塚尾怜司
Owner DEXERIALS CORP