Connector, manufacture method for connector and anisotropic conductive film to be used therein
An anisotropic, bonded body technology, applied in the direction of conductive connection, printed circuit manufacturing, conductive adhesive connection, etc., can solve problems such as cracks in electronic components or substrates, achieve sufficient particle deformation, excellent conduction reliability, and ensure particle deformation effect
Active Publication Date: 2012-01-04
DEXERIALS CORP
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Problems solved by technology
[0006] However, if the particle size of the conductive fine particles becomes smaller with the finer pitch of the bonding terminal, the pressure at the time of bonding (crimping) needs to be increased in order to ensure sufficient particle deformation, and as an electronic component or substrate When using low-strength materials such as glass as the material, cracks may occur in electronic parts or substrates during bonding (crimping).
Method used
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Effect test
Embodiment 1
[0061] -Production of Anisotropic Conductive Film (ACF1)-
[0062] Add 20 parts by mass of bisphenol-type liquid epoxy resin ("E828"; manufactured by Japan Epoxy Resins), 20 parts by mass of phenoxy resin ("PKHH"; manufactured by INCHEM Co., Ltd.) as the above-mentioned binder resin, 20 parts by mass of an amine-based latent curing agent (“HX3941”; manufactured by Asahi Kasei Chemicals), and adjusted to 1000 pieces / mm 2 Ni-Au plating resin particles (manufactured by Nippon Chemical Industry Co., Ltd., with an average particle diameter of 10 μm, hereinafter referred to as "gold particles") as the above-mentioned conductive particles, and added toluene as the above-mentioned solvent, prepared to contain in the binder A coating solution of a resin composition in which conductive particles are dispersed in a resin.
[0063] In addition, the average particle diameter of the said gold particle is the average value of the measured value of 10 points obtained by the measurement using...
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Abstract
Disclosed are a connector which can provide excellent conduction reliability while securing substantial crushing of particles even with a fine patched substrate being connected to an electronic part or so, and can prevent occurrence of short-circuiting, a manufacture method for the connector, and anisotropic conductive film to be used therein. The connector has a first substrate electrically connected to either a second substrate or an electronic part via an anisotropic conductive film containing conductive particles. The conductive particles that are pressure-bonded on wirings on the first substrate protrude from the wirings in both widthwise directions thereof. The interval between the wirings is equal to or greater than 3.5 times the average particle size of the conductive particles that are not pressure-bonded to the wirings.
Description
technical field [0001] The present invention relates to an electronic component such as an IC chip, a liquid crystal panel (LCD panel) of a liquid crystal display (LCD), and a substrate, or a bonded body that is electrically connected between substrates, a method for manufacturing the bonded body, and a use for the bonded body anisotropic conductive film. Background technique [0002] Conventionally, an anisotropic conductive adhesive film (ACF; Anisotropic Conductive Film) has been used as a method of connecting electronic components, circuit boards, and the like. This anisotropic conductive adhesive film is used to bond and electrically connect various terminals, for example, to connect terminals of flexible printed circuit boards (FPC) or IC chips to glass formed on LCD panels. ITO (Indium Tin Oxide) electrodes on the substrate. [0003] As the above-mentioned anisotropic conductive adhesive film, an anisotropic conductive adhesive film in which conductive particles are...
Claims
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IPC IPC(8): H05K1/14H01R11/01H01B5/16H05K3/36
CPCH01R12/57H01R4/04H05K3/361H05K3/323H01L2224/83101H05K2201/098H01L2924/07811Y10T29/49117H01L2924/00H01B5/16H01R11/01H05K1/14H05K3/36
Inventor 周藤俊之
Owner DEXERIALS CORP