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Adhesive arrangement

An adhesive and structural technology, applied in the direction of polyether adhesives, adhesive types, adhesives, etc., can solve problems such as incompatibility of surface treatment technology operation requirements

Inactive Publication Date: 2017-08-29
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, the remediation environment may not be compatible with the operational requirements of the surface preparation technology

Method used

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Examples

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Embodiment

[0021] Multiple samples were prepared by mixing the material at 30 rpm for 5 minutes followed by 80 rpm for 10 minutes. Film samples were prepared by compression molding using a 152mm x 152mm x 0.60mm metal frame. The polymer blend is placed between two PTFE or polyimide membranes and two steel plates are pressed into the membrane samples at the selected temperature and pressure. Film samples were peeled off and tested for shear tests.

[0022] In a first example, the shear strength of perfluoropolymer adhesives and fluoropolymer adhesives combining PTFE to PTFE was tested. The shear strength of PFA is about 3.19MPa, the shear strength of PTFE is about 2.59MPa, the shear strength of fluorinated ethylene propylene (FEP) is about 2.18MPa, tetrafluoroethylene-co-hexafluoropropylene-co-bias The shear strength of ethylene fluoride terpolymer (THV) is about 1.57MPa or 0.68MPa (depending on whether it is THV 815 or THV 2030 respectively), the shear strength of ethylene tetrafluoroe...

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Abstract

An adhesive arrangement (100) includes an adhesive formed from an adhesive composition (101) having a thermoplastic material and a melt-processable perfluoropolymeric material. The adhesive arrangement further includes a base layer (103) in contact with the adhesive. The thermoplastic material is polyetherimide (PEI), polypheny lenesulfide (PPS), polyaryletherketone (PAEK) including poly etheretherke tone (PEEK), polyamide (PA), and / or polysulfone derivatives including polysulfone. The base layer is a perfluoropolymeric material, a composite material, a metal material, a metallic material, another suitable material, or a combination thereof.

Description

technical field [0001] The present invention relates generally to adhesives. More specifically, the present invention relates to adhesive constructions having at least one layer in contact with the adhesive blend. Background technique [0002] Perfluoropolymers, such as polytetrafluoroethylene (PTFE), are difficult to incorporate due to their low surface energy, high crystallinity, symmetrical structure, and chemical resistance. To solve this problem, surface treatments such as chemical etching, plasma treatment or burning are used. Bonds to metals more easily than perfluoropolymers. Adhesives capable of bonding metals to perfluoropolymer surfaces, however, suffer from the same difficulties, partly due to the difficulty of bonding to perfluoropolymers and partly due to the surface energy of the metal (approximately 2 J / m 2 ) and the surface energy of PTFE (about 0.02J / m 2 ) difference. [0003] Some applications are not suitable for surface preparation. For example, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/12B32B15/04B32B15/08B32B27/08B32B27/28B32B27/32C08J5/12C09J7/02C09J127/18C09J7/22C09J7/24C09J7/30
CPCC09J7/22C09J7/24C09J7/30B32B7/12B32B15/043B32B15/08B32B27/08B32B27/28B32B27/322C08J5/128C09J127/12C09J127/18C09J179/08B32B2250/02B32B2307/542B32B2307/54C08J2327/12C08J2427/12C09J2400/163C09J2477/00C09J2471/00C09J2481/00C09J2479/08C09J2427/00C09J2427/006C08G73/1046C09J171/00C08G2650/40C08L27/18C08L79/08
Inventor 王雷云孝昌彼得·J·达顿
Owner TE CONNECTIVITY CORP