Solder ball container and package for storing solder ball

Abstract

The present invention prevents an accommodated solder ball from being crushed. A solder ball container 10 of the present invention has a container body 20 having a bottomed cylindrical shape, a cover part 40 having a flat plate part 41 that covers an opening part 23 of the container body 20 and a side part 42 that covers at least a part of the outer peripheral surface of the container body 30, and a flat-plate-shaped inner cap part 50 arranged inside the cover part 40. The flat plate part 41 has protrusion parts 44, 45 provided along the outer periphery thereof. The inner cap part 50 is configured to be pinched between the protrusion parts 44, 45 and an edge part 24 of the container body 20 and thereby deformed into a convex shape toward the opening part 23 of the container body 20 when the container body 20 is closed by using the cover part 40.

Description

Technical field [0001] The invention relates to a solder ball container and a package for solder ball storage. Background technique [0002] In recent years, due to the miniaturization of electronic devices, electronic components used in electronic devices have also become very small. Moreover, the electronic component is a multifunctional component with multiple functions. As a multifunctional component, there are BGA (Ball Grid Array) and CSP (Chip Size Package), etc., and multiple electrodes are provided on these multifunctional components. When the multifunctional component is actually mounted on the printed board, the bonding surface of the electrode and the printed board is soldered. [0003] In addition, in electronic components such as QFP (Quad Flat Package) and SOIC (Small Outlined Integrated Circuit), a bare chip with a plurality of electrodes is provided inside. Substrate welding. [0004] At the time of soldering as described above, it is very troublesome to individu...

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Problems solved by technology

[0010] However, in the solder ball container disclosed in Patent Document 1, when solder balls having a small particle size (for example, 0.1 mm or less) are stored, there is a problem that the solder ball is caught between the edge of the container body and the lid of the solder ball container. Small gaps between parts may

If solder balls are caught in the aforementioned gap, there is a problem that, for example, when the solder ball container is transported, the edge of the cover member moves relative to the container body, and the solder balls are crushed and the sphericity of the solder balls is impaired.

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