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Container, package and method for closing container

A container body and container technology, applied in the direction of closure, closure, bottle/container cover, etc., can solve problems such as solder ball crushing, solder ball sphericity damage, etc.

Active Publication Date: 2018-09-04
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the solder ball container disclosed in Patent Document 1, when solder balls having a small particle size (for example, 0.1 mm or less) are stored, there is a problem that the solder ball is caught between the edge of the container body and the lid of the solder ball container. Small gaps between parts may
If solder balls are caught in the aforementioned gap, there is a problem that, for example, when the solder ball container is transported, the edge of the cover member moves relative to the container body, and the solder balls are crushed and the sphericity of the solder balls is impaired.

Method used

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  • Container, package and method for closing container
  • Container, package and method for closing container
  • Container, package and method for closing container

Examples

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Embodiment Construction

[0030] Hereinafter, embodiments of the solder ball container and the solder ball storage package according to the present invention will be described with reference to the drawings. In the drawings described below, the same reference numerals are assigned to the same or corresponding components, and overlapping descriptions will be omitted.

[0031] figure 1 It is a perspective view of the solder ball container of this embodiment. The solder ball container 10 has a bottomed cylindrical container body 20 and a lid 40 for closing an opening (not shown) of the container body 20 . The container body 20 has an internal space capable of accommodating solder balls, and the lid 40 closes the opening to close the internal space. The lid portion 40 does not completely seal the inner space of the container body 20 . Hereinafter, the structures of the container body 20 , the cover 40 , and the inner plug provided inside the cover 40 constituting the solder ball container 10 will be des...

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PUM

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Abstract

The present invention prevents an accommodated solder ball from being crushed. A solder ball container 10 of the present invention has a container body 20 having a bottomed cylindrical shape, a cover part 40 having a flat plate part 41 that covers an opening part 23 of the container body 20 and a side part 42 that covers at least a part of the outer peripheral surface of the container body 30, and a flat-plate-shaped inner cap part 50 arranged inside the cover part 40. The flat plate part 41 has protrusion parts 44, 45 provided along the outer periphery thereof. The inner cap part 50 is configured to be pinched between the protrusion parts 44, 45 and an edge part 24 of the container body 20 and thereby deformed into a convex shape toward the opening part 23 of the container body 20 when the container body 20 is closed using the cover part 40.

Description

technical field [0001] The present invention relates to a solder ball container and a solder ball storage package. Background technique [0002] In recent years, due to miniaturization of electronic equipment, electronic components used in electronic equipment have also become extremely small. Furthermore, this electronic component is a multifunctional component having multiple functions. As multifunctional components, there are BGA (Ball Grid Array: Ball Grid Array) and CSP (Chip Size Package: Chip Size Package), etc., and a plurality of electrodes are provided on these multifunctional components. When actually mounting the multifunctional component on the printed circuit board, the bonding surface between the electrodes and the printed circuit board is soldered. [0003] In addition, in electronic components such as QFP (Quad Flat Package: Quad Flat Package) and SOIC (Small Outlined Integrated Circuit: Small Integrated Circuit), a bare chip with a plurality of electrodes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D85/00B65D41/04B65D53/04
CPCB65D41/04B65D53/04B65D85/00
Inventor 佐藤勇佐野尊文相马大辅大西裕规荒木祐二
Owner SENJU METAL IND CO LTD