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Void structured film bonded through catalytic action and method for manufacturing same

A technology of void structure and manufacturing method, applied in the direction of coating, etc., can solve problems such as cracks and inability to continue production

Active Publication Date: 2017-08-29
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to perform high-temperature treatment at 200°C or higher for a long time during firing treatment, batch treatment is a prerequisite, and industrial continuous production cannot be performed.
In addition, once the crystalline stable phase of silica gel changes from a low-temperature phase to a high-temperature phase during sintering, there is a problem of cracking due to a large volume change when the sintering is completed and left to cool.

Method used

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  • Void structured film bonded through catalytic action and method for manufacturing same
  • Void structured film bonded through catalytic action and method for manufacturing same
  • Void structured film bonded through catalytic action and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0186] In this example, the void structure membrane (porous silicone body) of the present invention was produced as follows.

[0187] (1) Gelation of silicon compounds

[0188] 0.95 g of MTMS, which is a precursor of the silicon compound, was dissolved in 2.2 g of DMSO. 0.5 g of a 0.01 mol / L oxalic acid aqueous solution was added to the above mixed solution, and MTMS was hydrolyzed by stirring at room temperature for 30 minutes to generate tris(hydroxy)methylsilane.

[0189] Add 0.38 g of 28% concentration of ammonia water and 0.2 g of pure water to 5.5 g of DMSO, then add the above-mentioned mixed solution that has been hydrolyzed, and stir at room temperature for 15 minutes to solidify tris(hydroxyl)methylsilane. Gelling to obtain a gel-like silicon compound.

[0190] (2) Aging treatment

[0191] The above-mentioned gelatinized mixture was directly cultured at 40° C. for 20 hours to perform aging treatment.

[0192] (3) Crushing treatment

[0193] Next, the aging-treate...

Embodiment 2

[0206] In this example, the void structure membrane (porous silicone body) of the present invention was produced as follows.

[0207] First, the above "(1) gelation of silicon compound" and "(2) aging treatment" were performed in the same manner as in Example 1. Next, an IPA (isopropanol) solution of 1.5% by weight of a photobase generating catalyst (Wako Pure Chemical Industries, Ltd.: trade name WPBG266) was added to the above-mentioned sol particle liquid instead of 0.3% by weight of KOH aqueous solution, in addition, The above "(3) pulverization treatment" was performed in the same manner as in Example 1 to prepare a coating liquid. The addition amount of the IPA solution of the said photobase generation catalyst was set to 0.031g with respect to 0.75g of the said sol particle liquid. Thereafter, the above "(4) Formation of a coating film and formation of a porous silicone body" was carried out in the same manner as in Example 1. The dried porous body obtained as above w...

Embodiment 3

[0209] The porous structure of the present example was formed in the same manner as in Example 2, except that heat aging was not performed after UV irradiation.

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Abstract

The purpose of the present invention is to provide, for example, a void structured film in which a porous structure with a high porosity is formed while preventing cracking and which has a high strength. The void structured film according to the present invention is characterized in that one or more kinds of structural units for forming a microvoid structure are chemically bonded together through a catalytic action. The void structured film according to the present invention has an excoriation resistance of 60-100% when measured by using, for example, Bemcot (registered trademark) and the number of times of folding endurance in an MIT test of 100 or greater. The void structured film can be manufactured by forming a precursor of a porous silicone body with the use of, for example, a sol containing ground pieces of a gel-type silicon compound, and then chemically bonding the ground pieces contained in the precursor of the porous silicone body. It is preferred that the ground pieces are chemically bonded together through, for example, chemical cross-linking.

Description

technical field [0001] The present invention relates to a membrane with a void structure bonded through catalytic action and a manufacturing method thereof. Background technique [0002] Many examples of porous structures using various materials and manufacturing methods can be seen, and they are used in products in a wide range of fields, such as optical members such as low-refractive index layers, heat insulating materials, sound-absorbing materials, and substrates for regenerative medicine. . The above-mentioned porous structure includes a closed-cell structure in which single voids (voids) are dispersed, an open-cell structure in which the above-mentioned closed-cell structures are closely connected, etc., which are expressed in a dispersed state. definition. In addition, there are also definitions in terms of pore size or various porous structures. [0003] As a method of producing such a porous structure, for example, there is a method in which the skeleton structur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/24C08G77/44C08J9/28C08J7/043C08J7/046C08J7/054
CPCC09D183/04C08G77/04C08J2367/02C08J2483/04C09D7/61C08J7/0427C08J7/043C08J7/054C08J7/046C08J9/24C08J9/28C08J2201/026C08J2203/10C08J2383/16C08K3/36C09D183/16
Inventor 服部大辅春田裕宗中村恒三宇和田一贵武本博之村上奈穗
Owner NITTO DENKO CORP