A kind of semiconductor production method
A production method and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of reducing product yield, position offset, product scrapping, etc., to reduce production difficulty and improve yield , to avoid the effect of tilting
Active Publication Date: 2020-11-20
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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Problems solved by technology
In the existing semiconductor production process, the position of the copper bridge frame usually shifts when it is soldered to the lead frame by reflow soldering, and the shift often exceeds the allowable range of production, which leads to product scrapping and reduces the yield of the product
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[0047] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0048] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct...
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The invention discloses a semiconductor production method, which provides a lead frame and a copper bridge frame with a positioning hole, prints a bonding material on the surface of the lead frame, and stamps on the lead frame after printing the bonding material to form a connection with the positioning hole. Inserting the matching positioning teeth, assembling the lead frame and the copper bridge frame, and welding the lead frame and the copper bridge frame by means of reflow soldering. By stamping the positioning tooth after printing the bonding material on the lead frame, the positioning tooth can be used to plug into the positioning hole on the copper bridge frame to realize the welding positioning of the copper bridge frame, which can effectively prevent the position deviation during the reflow soldering of the copper bridge frame in the later stage And other defects, to ensure that the copper bridge frame will not be disturbed during the reflow process, improve the yield of the product, and because the positioning teeth are stamped after printing the bonding material, the production difficulty can be reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor production method. Background technique [0002] At present, the production process of semiconductors is mainly as follows: setting bonding material on the lead frame, placing the chip to be welded on the corresponding position of the bonding material, reflow soldering the chip and the lead frame through the bonding material, printing the bonding material on the surface of the chip and the lead frame, and then The copper bridge frame is placed on the lead frame and chip, and then the copper bridge frame is reflow soldered. In the existing semiconductor production process, the position of the copper bridge frame usually shifts when it is soldered to the lead frame by reflow soldering, and the shift often exceeds the production allowable range, which leads to product scrapping and reduces the yield of the product. Contents of the invention [0003] The obj...
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IPC IPC(8): H01L21/60
CPCH01L24/83H01L2224/83815H01L2224/97H01L2224/38H01L2224/40245
Inventor 曹周黄源炜桑林波
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD