Flexible array substrate and manufacturing method thereof, flexible display

Abstract

The invention provides a flexible array substrate, a manufacturing method thereof, and a flexible display. The flexible array substrate includes: a flexible substrate; a display area disposed on one side of the flexible substrate; a non-display area disposed around the display area; a protective layer covering the source-drain electrode layer of the non-display area; and a protective barrier wall, It is set on the side of the non-display area close to the display area to limit the width of the protective layer. In the flexible array substrate proposed by the present invention, the side of the non-display area close to the display area is provided with a protective layer blocking wall, which can restrict the flow of the glue material to the light-emitting area when making the protective layer in the bending area, so as to ensure the coating of the protective layer. While ensuring the uniformity of the coating thickness, it can also limit the width of the protective layer, thereby effectively shortening the climbing area, and thus facilitating the realization of the narrow frame effect.

Description

technical field [0001] The invention relates to the technical field of flexible display screens, in particular, the invention relates to a flexible array substrate, a manufacturing method thereof, and a flexible display. Background technique [0002] At present, existing display products (such as Samsung Galaxy Note7) use the bendability of flexible substrates to bend the position (Fanout, fan-out area) where the pixel leads are connected to external circuits to achieve the effect of narrow borders, which we call Pad bending (Pad bending) design, the specific structure before bending can refer to figure 1 . Compared with rigid OLED, the Fanout area designed by pad bending does not use gate (Gate) leads, but uses source-drain electrode (SD) layer to connect with external circuits. On the SD surface, there are only organic layers such as organic film (PLN) and pixel definition (PDL), which are easily corroded by water vapor after bending. Therefore, protective glue should b...

AI Technical Summary

Problems solved by technology

In the actual production process, due to the fluidity of the adhesive material, the thickness of B and C will generally be much lower than the middle position A, so it is easy to cause line breakage at positions D and E during bending

Therefore, in order to ensure a uniform glue thickness at the bending position, the glue material generally needs to be coated with a wider (about 700um) climbing area (Dummy) area, that is, the position shown in L1, so that the border is correspondingly wider, so as not to Conducive to achieve the effect of narrow border

[0004] Therefore, the pad bending design structure of flexible OLEDs at this stage still needs to be improved.

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