Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Robot intelligent up-and-down printed circuit board system and circuit board transfer method

A printed circuit board, robot intelligence technology, applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems that affect the detection efficiency, prolong the time of board loading and unloading, and increase the complexity of the operation time of the mechanical arm, so as to improve the detection efficiency , shorten the exercise time, shorten the effect of waiting time

Inactive Publication Date: 2017-09-15
GUANGZHOU TAILI ELECTRICAL & MECHANICAL EQUIP CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing upper and lower board system will install the auxiliary fixture above the second AOI machine to facilitate the docking between the two circuit boards with the manipulator fixture. Although this upper and lower board system can realize the detection and coding of the circuit board, However, since the auxiliary fixture is installed above the second AOI machine, that is, on the right side of the robotic arm, to realize double-sided detection and double-sided coding of the circuit board, the mechanical rear fixture must be turned over several times, which increases the running time and rotation of the robotic arm. The complexity prolongs the loading and unloading time of each circuit board and affects the detection efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Robot intelligent up-and-down printed circuit board system and circuit board transfer method
  • Robot intelligent up-and-down printed circuit board system and circuit board transfer method
  • Robot intelligent up-and-down printed circuit board system and circuit board transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] Such as figure 1 As shown, a robot intelligent upper and lower printed circuit board system provided by the present invention includes a feeding device 1, a discharging device 2, a dust sticking machine 3, a double transfer device 4, an image sensor (not shown in the figure), a robot 5 , the manipulator gripper 6, the first auxiliary gripper 7, the first vertical movement mechanism 8, the plate taking device 9 and the first longitudinal movement mechanism 10, the discharge device 2, the feeding device 1 and the dust sticking machine 3 from right to Arranged side by side on the left side, the double transfer device 4 is arranged above the discharging device 2, the feeding device 1 and the dust sticking machine 3, the robot 5 is opposite to the feeding device 1 and the dust sticking machine 3, and the manipulator clamp 6 is installed on ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a robot intelligent up-and-down printed circuit board system and a circuit board transfer method. The robot intelligent up-and-down printed circuit board system comprises a feeding device, a discharging device, a dust sticking machine, a dual transfer device, a robot, a mechanical arm clamp, a first auxiliary clamp, a first vertical movement mechanism, a board takeoff device and a first longitudinal movement mechanism. The discharging device, the feeding device and the dust sticking machine are arranged from right to left side by side. The dual transfer device is arranged above the discharging device, the feeding device and the dust sticking machine. The robot is opposite to the feeding device and the dust sticking machine. The mechanical arm clamp is mounted at the front end of a mechanical arm of the robot. The first auxiliary clamp is arranged on the left side of the robot and moves in the vertical direction through the first vertical movement mechanism. The board takeoff device is arranged on the right side of the robot and moves above the discharging device in the longitudinal direction through the first longitudinal movement mechanism. According to the robot intelligent up-and-down printed circuit board system, the movement path and time of the robot are reduced, the wait time of other components is shortened, and the detection efficiency of the whole detection system is effectively improved.

Description

technical field [0001] The invention relates to a robot intelligent upper and lower printed circuit board system and a circuit board transfer method, belonging to the technical field of printed circuit board detection auxiliary equipment. Background technique [0002] At present, in the process of printed circuit board processing and production, the printed circuit board automatic detection system needs to perform double-sided detection and inkjet processing on each printed circuit board. Most of the automatic inspection systems for printed circuit boards are composed of two automatic optical inspection machines (AOI), two inkjet printers, and upper and lower board systems. After the detection of the S surface, the first inkjet printer will spray the code on the S surface of the circuit board, and after the S surface of the circuit board is sprayed, the upper and lower board systems will move the circuit board to the second AOI machine. The second AOI machine detects the C ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90
CPCB65G47/901
Inventor 孙雪峰王明道黄利明
Owner GUANGZHOU TAILI ELECTRICAL & MECHANICAL EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products