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A test device and test method for deep plating ability of through hole

A test device and deep plating technology, applied in electrolytic components, electrolytic process, etc., can solve problems such as failure to meet through-hole deep plating capability verification, poor deep plating sample effect, etc., and achieve the effect of shortening production time and uniform and stable temperature

Active Publication Date: 2019-01-25
贵州振华群英电器有限公司(国营第八九一厂)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the test of additives for deep plating ability is currently judged by the bright position of the additive, and the test verification is also carried out with test pieces, which cannot meet the deep plating ability verification of through holes.
Multiple test strip tests have verified that its positioning is good, but the effect of deep-plated samples is not good

Method used

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  • A test device and test method for deep plating ability of through hole
  • A test device and test method for deep plating ability of through hole

Examples

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Effect test

Embodiment 1

[0027] A test device for deep plating ability of through holes, consisting of figure 1 and figure 2 As shown, it includes a cathode conductive rod 1, both ends of the cathode conductive rod 1 are connected to a conductive hook 2, and the bottom of the conductive hook 2 is connected to a wire 3.

[0028] The wire 3 is a copper wire of Ф0.07-0.09;

[0029] The wire 3 is a Φ0.08 copper wire.

[0030] A method for testing with the aforementioned through-hole deep plating ability test device, specifically comprising the following steps:

[0031] (1) Prepare 1L of nickel plating solution and place it in the Hull cell, adjust the pH to 4.2-4.8, and the temperature is 50-55°C; the content of the nickel plating solution is 280g / L of nickel sulfate, 75g / L of nickel chloride and Boric acid 40g / L;

[0032] (2) Add additives that need to be tested or verified to improve deep plating ability; the content of additives is glycine 6ml / L, sodium butynyl sulfonate 1.5ml / L, sodium propynyl a...

Embodiment 2

[0040] A test device for deep plating ability of through holes, consisting of figure 1 and figure 2 As shown, it includes a cathode conductive rod 1, both ends of the cathode conductive rod 1 are connected to a conductive hook 2, and the bottom of the conductive hook 2 is connected to a wire 3.

[0041] The wire 3 is a copper wire of Ф0.07-0.09;

[0042] The wire 3 is a Φ0.08 copper wire.

[0043] A method for testing with the aforementioned through-hole deep plating ability test device, specifically comprising the following steps:

[0044] (1) Prepare 1L of nickel plating solution and place it in the Hull cell, adjust the pH to 4.2-4.8, and the temperature is 50-55°C; the content of the nickel plating solution is 320g / L of nickel sulfate, 90g / L of nickel chloride and Boric acid 50g / L;

[0045] (2) Add additives that need to be tested or verified to improve the deep plating ability; the content of the additives is 8ml / L of aminoacetic acid, 2ml / L of sodium butynyl sulfona...

Embodiment 3

[0053] A test device for deep plating ability of through holes, consisting of figure 1 and figure 2 As shown, it includes a cathode conductive rod 1, both ends of the cathode conductive rod 1 are connected to a conductive hook 2, and the bottom of the conductive hook 2 is connected to a wire 3.

[0054] The wire 3 is a copper wire of Ф0.07-0.09;

[0055] The wire 3 is a Φ0.08 copper wire.

[0056] A method for testing with the aforementioned through-hole deep plating ability test device, specifically comprising the following steps:

[0057] (1) Prepare 1L of nickel plating solution and place it in the Hull cell, adjust the pH to 4.2-4.8, and the temperature is 50-55°C; the content of the nickel plating solution is 220g / L of nickel sulfate, 60g / L of nickel chloride and Boric acid 30g / L;

[0058] (2) Add additives that need to be tested or verified to improve the deep-plating ability; the content of the additives is 4ml / L of aminoacetic acid, 1ml / L of sodium butynyl sulfona...

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Abstract

The invention discloses a test device for deep plating capacity of through holes, which comprises a cathode conductive rod (1), the two ends of the cathode conductive rod (1) are connected to a conductive hook (2), and the bottom of the conductive hook (2) is connected to a wire (3). . The use of the device for testing speeds up the matching between the test and the actual production, and improves the ability to transform the test results into production and application.

Description

technical field [0001] The invention relates to a test device and a test method for deep plating ability of through holes, in particular to a test device and test method for deep plating ability of through holes with good effect of deep plating samples. Background technique [0002] The electroplating industry often encounters the electroplating of workpieces with long through holes. Generally, electroless nickel plating is used for apertures smaller than Ф6×30. However, with the strict implementation of environmental protection requirements, the wastewater treatment of electroless nickel plating solution has become a bottleneck in the production of enterprises. Enterprises urgently need electroplating nickel instead of electroless nickel plating under the condition of quality assurance. First, the wastewater treatment is solved, and second, the cost is greatly reduced. With the Hull cell test of the test piece, all the additives that increase the deep plating ability meet t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D17/00C25D7/00
CPCC25D3/12C25D7/00C25D17/00
Inventor 王思醇宋泽洪田军
Owner 贵州振华群英电器有限公司(国营第八九一厂)
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