Flexible electronic device and manufacturing method therefor

A flexible electronic device and a flexible technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of electrical performance and anti-kneading performance of electronic devices, and achieve the effect of ensuring electrical performance and anti-kneading performance.

Active Publication Date: 2017-09-26
KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT +1
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a flexible electronic device and its manufacturing method to solve the problem that the existin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible electronic device and manufacturing method therefor
  • Flexible electronic device and manufacturing method therefor
  • Flexible electronic device and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] [Example One]

[0034] Please refer to image 3 , Which is a schematic structural diagram of a flexible electronic device according to an embodiment of the present invention. Such as image 3 As shown, the flexible electronic device 200 includes: a flexible substrate 210 and a device layer formed on the flexible substrate 210; the device layer includes a semiconductor structure 220 and a first wire structure 230 connected to each other, the first The extending direction of the wire structure 230 is consistent with the channel direction of the semiconductor structure 220; the extending direction of the first wire structure 230 and the stretching direction of the flexible substrate 210 form an included angle of less than 90°. The semiconductor structure in the embodiment of the present invention is a thin film transistor structure, which specifically includes a gate, a drain (not shown in the figure), and a channel.

[0035] Specifically, in the flexible electronic device 200...

Example Embodiment

[0048] [Example 2]

[0049] Please refer to Figure 5 , Which is a schematic structural diagram of a flexible electronic device according to the second embodiment of the present invention. Such as Figure 5 As shown, the flexible electronic device 300 includes: a flexible substrate 310 and a device layer 330 formed on the flexible substrate 310; the device layer 330 includes interconnected semiconductor structures (not shown in the figure) and a first Wire structure (not shown in the figure), the extending direction of the first wire structure is consistent with the channel direction of the semiconductor structure; the extending direction of the first wire structure is formed by the stretching direction of the flexible substrate 310 The included angle is less than 90°.

[0050] Specifically, in the flexible electronic device 300, the device layer 330 includes a plurality of pixel units 30 and a first wire structure. The plurality of pixel units 30 are arranged in an array, and eac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Angleaaaaaaaaaa
Login to view more

Abstract

The invention provides a flexible electronic device and a manufacturing method therefor. The electronic device comprises a flexible substrate and a device layer formed on the flexible substrate. The device comprises a semiconductor structure and a wire structure, which are connected with each other. The extending direction of the wire structure is consistent with the trench direction of the semiconductor structure. The extending direction of a first wire structure and the stretching direction of the flexible substrate form an inclined angle which is less than 90 degrees. According to the invention, the impact on the semiconductor structure and the first wire structure from stress is reduced to the minimum value through the adjustment of the trench direction of the semiconductor structure and the extending direction of the first wire structure, thereby guaranteeing the electrical performances and anti-kneading performances of the flexible electronic device.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to a flexible electronic device and a manufacturing method thereof. Background technique [0002] Flexible electronics (Flexible Electronics) technology is an electronic technology based on flexible substrates. Due to its unique flexibility and ductility, it has broad application prospects in information, energy, medical, national defense and other fields. Flexible electronic devices made by flexible electronic technology have the characteristics of being thin and light, and can be bent or rolled into arbitrary shapes, such as flexible printed circuit boards, flexible chips and flexible displays. [0003] Existing flexible electronic devices usually include a flexible substrate and a device layer fabricated on the flexible substrate, the device layer includes a semiconductor structure and a wire structure, the semiconductor structure acts as a switch, and the wire struc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L27/12G09F9/30
CPCG09F9/301H01L27/1222H01L27/124H01L27/1259H01L27/127G09F9/30H01L27/12H01L27/1244Y02E10/549Y02P70/50H01L23/49838H10K77/111G02F1/133305G06F1/1652
Inventor 单奇胡坤林立蔡世星刘胜芳
Owner KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products