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A miniature air conditioner based on semiconductor refrigeration chips

A refrigeration chip and semiconductor technology, which is applied in the direction of refrigerators, refrigeration components, air conditioning systems, etc., can solve the problems of low refrigeration efficiency and high heating efficiency, and achieve the effect of various functions and improved refrigeration efficiency

Inactive Publication Date: 2019-10-29
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

2. The semiconductor refrigeration chip has two functions, which can not only cool, but also heat. The cooling efficiency is generally not high, but the heating efficiency is very high, always greater than 1

Method used

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  • A miniature air conditioner based on semiconductor refrigeration chips
  • A miniature air conditioner based on semiconductor refrigeration chips
  • A miniature air conditioner based on semiconductor refrigeration chips

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Experimental program
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Embodiment Construction

[0039] In order to describe the present invention more specifically, the technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0040] figure 1 Shown is a schematic diagram of the overall structure of the mini air conditioner of the present invention. Including the main circuit unit, the main circuit unit includes a DC voltage source V, an ordinary switch K0, a double-pole double-throw switch K1, an ordinary switch K2, a semiconductor refrigeration chip TEC1-127 series, a heat dissipation convection motor, and an air outlet motor One, variable resistor R; Among them, the general switch K0 is the main power switch, the double-pole double-throw switch K1 is used to select the cooling or heating mode, the general switch K2 is used to control the fan motor; the semiconductor cooling chip TEC1 Both sides are coated with heat-conducting glue, which is glued to two heat sinks, the heat ...

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PUM

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Abstract

The invention discloses a miniature air conditioner based on a semiconductor chilling plate. The miniature air conditioner based on the semiconductor chilling plate comprises a heat preservation tank unit, a main circuit unit, a heat dissipation unit, a convection unit and an air exhaust unit, wherein the main circuit unit, the heat dissipation unit, the convection unit and the air exhaust unit are arranged in the heat preservation tank. According to the air conditioner, the characteristic of reversing of the cooling end and the heating end can be achieved through polarity reversing of the semiconductor chilling plate; the air conditioner integrates the refrigeration function and the heating function through design of the simple circuit; besides, by adopting the semiconductor chilling plate instead of a compressor, the necessary equipment size of the air conditioner is greatly reduced, and thus the air conditioner can be carried while an existing air conditioner with the compressor is difficult to carry; and in addition, the air conditioner has the advantage of having the diverse functions such as refrigeration, cooling and article storage, and has practical value.

Description

technical field [0001] The invention belongs to the field of power electronic products, and in particular relates to a miniature air conditioner based on a semiconductor refrigerating sheet, which can provide multiple functional modes. Background technique [0002] A semiconductor cooler, also called a thermoelectric cooler, is a heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. When direct current passes through a galvanic couple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, is characterized by no moving parts, and is relatively reliable. In addition, if the positive and negative poles of the semiconductor refrigeration sheet are reversed, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24F5/00F24F11/88F24F11/89F25B21/02F25B49/00
CPCF24F5/0042F25B21/02F25B49/00F25B2321/0251
Inventor 金萧
Owner ZHEJIANG UNIV