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Thin and dry floor heating module with high thermal conductivity, and manufacture method thereof

A manufacturing method and high thermal conductivity technology, applied in the field of high thermal conductivity thin dry-type floor heating modules, can solve the problems of floating dust, raised ground, unfavorable heat insulation, etc., and achieve the effect of high thermal efficiency, uniform heat dissipation, and thin overall thickness

Inactive Publication Date: 2017-10-10
苏州灵均暖通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the upper floor is made of wooden floor, if the wet laying method is used, the height of the entire ground will be raised, which will affect the use of the building
If the upper floor is made of wood, use extruded plastic board as the heat insulation layer without cement leveling layer. The extruded plastic board and heating element are easily affected by the external environment, and floating dust may appear, which is not conducive to heat insulation

Method used

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  • Thin and dry floor heating module with high thermal conductivity, and manufacture method thereof
  • Thin and dry floor heating module with high thermal conductivity, and manufacture method thereof

Examples

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Embodiment

[0026] Such as figure 1 A thin dry-type floor heating module with high thermal conductivity is shown, including a heat insulation board 1, a coupling frame 2, an insulation layer 3, a high thermal conductivity layer 4, and a heating pipe 5. The coupling frame 2 is provided with a pipe groove 6, and the coupling frame 2, the thermal insulation layer 3 and the high thermal conductivity layer 4 are laid in sequence, and the heating pipe 5 is arranged on the top of the high thermal conductivity layer 4 corresponding to the position of the pipe groove 5. Platform 14, the moisture-proof layer 12 is arranged under the sub-base plate 13, the anti-skid layer 11 is arranged under the moisture-proof layer 12, the bosses 14 are arranged above the bottom plate 13, and reinforcing ribs 15 are arranged between the adjacent bosses 14. The pipe groove 6 is in an inverted Ω shape, and its depth is greater than the diameter of the heating pipe. The high thermal conductivity layer 4 is a thermal...

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PUM

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Abstract

The invention discloses a thin and dry floor heating module with high thermal conductivity, and a manufacture method thereof. The floor heating module comprises a thermal baffle, a linkage frame, a thermal insulation layer, a high thermal conductive layer and a heating pipe, and the linkage frame is provided with a pipe channel; the thermal insulation layer and the high thermal conductive layer are laid on the linkage frame in sequence, and the position, corresponding to the pipe channel, above the high thermal conductive layer is provided with the heating pipe; the thermal baffle comprises an anti-skid layer, a damp-proof layer, a base plate and bosses, and the damp-proof layer is arranged below the base plate; and the anti-skid layer is arranged below the damp-proof layer, and the bosses are arranged above the base plate; and reinforcing ribs are arranged between the adjacent bosses. Pure aluminum thermal conductive layers are adopted on the linkage frame of the floor heating module for comprehensive thermal conduction, and the thermal conductivity is five times that of the traditional heating module; heat is dissipated upward comprehensively and uniformly, and the thermal efficiency is high; the traditional sediment backfill is replaced, and the overall thickness is thin.

Description

technical field [0001] The invention relates to the field of heating control, in particular to a thin dry floor heating module with high thermal conductivity. Background technique [0002] Floor heating is the abbreviation of floor radiant heating. It uses the whole ground as a radiator, and heats the whole ground evenly through the heat medium in the radiant layer of the floor. It uses the heat storage and heat radiation of the ground itself from bottom to top To conduct conduction to achieve the purpose of heating. Dry floor heating is also called ultra-thin floor heating. Compared with ordinary floor heating installation methods, it does not require floor heating backfill, so it is named dry floor heating. [0003] Compared with traditional heating methods, floor heating has the advantages of uniform heat dissipation, comfort, cleanness and health, environmental protection and energy saving, elegant appearance, safety and reliability, long life and high-efficiency sound ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D13/02E04F15/18
CPCF24D13/024E04F15/181E04F2290/023
Inventor 金永其
Owner 苏州灵均暖通科技有限公司